Ab Two Component Transparent Thermal Silicone Encapsulant for Solar Cells
China Ab Two Component Transparent Thermal Silicone Encapsulant for Solar Cells, Find details about China Thermal Encapsulant, Silicone Thermal Encapsulant from Ab Two Component Transparent Thermal Silicone Encapsulant for Solar Cells
Basic Info.
Model NO.
BM810
Characteristic
Waterproof
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Transparent
Viscosity
1980cps
Operable Time
≤60min
Curing Time(25c)
480min
Hardness
50--60 Shorea
Thermal Conductivity
1.0W/M.K
Dielectric Strength
More Than27kv/mm
Flame Rating
94-V0
Certifications
SGS/ISO9001/RoHS
Sample
Existing Sample
Dieletric Constant
3.0~3.3(1.2MHz\)
Trademark
Karefonte
Transport Package
Tin Packing
Specification
10kg/25kg
Origin
Shenzhen, Guangdong
HS Code
3506919090
Model NO.
BM810
Characteristic
Waterproof
Promoter Composition
Curing Agent
Composition
Organic Material
Color
Transparent
Viscosity
1980cps
Operable Time
≤60min
Curing Time(25c)
480min
Hardness
50--60 Shorea
Thermal Conductivity
1.0W/M.K
Dielectric Strength
More Than27kv/mm
Flame Rating
94-V0
Certifications
SGS/ISO9001/RoHS
Sample
Existing Sample
Dieletric Constant
3.0~3.3(1.2MHz\)
Trademark
Karefonte
Transport Package
Tin Packing
Specification
10kg/25kg
Origin
Shenzhen, Guangdong
HS Code
3506919090
Product Desciption
Two Component Silicone Sealant Features
1. Operation time: operation time within 240 minutes at room temperature2. Easy to operate
3. Bonding material widely: can be applied to PC, ABS, PP, PVC, etc., other materials and the surface of metal
4. With excellent electrical properties: excellent insulating performance, thermal conductivity, heat dissipation, anti-shock, corona resistance,
5. Temperature Resistant Performance: high and low temperature resistance, good aging resistance.
6. Flexible Glue Film: no shrikage during curing, excellent toughness of the elastomer is formed after curing, absorb vibration and shock, good impact resistance, good cushioning effect, for electronics, eletrical appliances, glass and other fragile products, to provide excellent resistance to shocks and reliability.
7. Strong Weather Resistance: anti-ultraviolet radiation, aging resistance, anti-ozone, moisture proof, waterproof, resist to salt atmosphere, mold, etc., can work in the harsh natural environmental.
Application
1. LED light/driver
2. Power switch
3. Electronic component
4. Electronic circuit, etc.
Advantages
1. High thermal conductivity: provides the highest thermal conductivity with its viscosity range in the world.
2. Low stress: exhibits low shrinkage and stress on components as it is curing; low thermal expansion after curing
3. Highly reliable: composed of an addition-curing polydimethly siloxane polymer that will not deploymerize when heated in confined spaces
4. Low viscosity: maintains low viscosity for ease of component encapsulation compared to other highly thermal conductive materials
5. Environmentally Resistant: Provides excellent thermal shock resistance
6. Meets requirements of 94 V-0 standard, provides excellent flame retardancy.
Thermal Silicone Encapsulants
The thermal conductive encapsulants add molding organic silicone sealant, use imported organic silicone as the main material, select the polymer materials as fillers, manufactured elaborately electronic potting glue. The viscosity of the glue can be divided into into high, middle, low three type, color also can be optional according to customers' demand and has heating conducting, flame retardant, bonding, sealing, waterproof, potting and encapsulation properties.
Physical Properties
| Properties Parameter Table | ||||||
| Before Curing | Component(1:1) | Viscosity(cps) | Color | Component(10:1) | Viscosity | Color |
| B Group | 3000 | White | A Group | 1000~2000 | White/Black | |
| A Group | 1520 | Black/Grey/White | B Group | 1000~2500 | Transparency | |
| Operating Performance | Test Item | Unit | Numerical Value | Numerical Value | Test Method | |
| Mixture Ratio | KG | 1:1 | 10:1 | Metage | ||
| After Mixture Viscosity | cps | 1980 | 2000 | T1794 | ||
| Operable Time | Min 25ºC | ≤60 | ≤80 | TM650 | ||
| Curing Time | Min 25ºC | 480 | 500 | TM650 | ||
| Curing Time | Min 80ºC | 30 | 40 | TM650 | ||
| After Curing | Hardness | ShoreA | 50~60 | 50~60 | ASTM D2240 | |
| Thermal Conductivity | W/m.k | 0.8 | 0.6 | ASTM D5470 | ||
| Dielectric Strength | KV/mm | ≥27 | ≥15 | ASTM D149 | ||
| Dielectric Constant | 1.2MHz | 3.0~3.3 | 3 | GB/T 12636 | ||
| Volume Resistivity | Ω.cm | ≥1.0*10∧18 | ≥1.0*10∧14 | ASTM D257 | ||
| Flame Rating | -- | 94 V-O | 94 V-0 | |||
Our Services
1. In time delivery
2. Quality assurance
3. Competitive price
4. Free samples are available
5. Customized order is available
6. Professional recommendations on products choice
Why Choose Us?
1. Here you will find the most competitive factory price which is almost equal to the actual cost
2. We will make a strict time schedule for your order to 100% ensnures the timely delivery.
3. We can make the tape into the size or shapes as requested
4. You will be kept updated of the production state during the whole production process.
5. Over 5 years on the thermal silicone encapsulant manufacturing.
6. Prompt reply within 12 hours
7. Custom logo printing is accepted.
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