Application: The mass production of chip component tended to bond together each other and micro metal parts.

Project experiences: Electroplating production line for SMC, connectors etc.

Feature: The vibrating screen with open structure can avoid any shielding effects caused by the solution circulation. So the higher upper limit of electric current density is used, deposition rate is speeded up, and the resistance of plating solution is small; Vibration plating is not rolling like barrel plating, for this reason it reduces the gall of work pieces by rolling; Vibration plating make current on parts surface evenly distribute, and improves thickness uniformity of electrodeposits; It will not catch of stick parts sometimes like barrel plating, the qualified ratio of product was improved obviously.

Technical Fpecification: Capacity 0.25~25Kg; Vibrating screen diamete Φ 150~V500mm.

Option: Shaking frequency adjustment, rectifier automatic control system, computer control system.