Products

Induction Cooker PCB Design Schematics Reverse Engineering

China Induction Cooker PCB Design Schematics Reverse Engineering, Find details about China PCB, 4 Layer from Induction Cooker PCB Design Schematics Reverse Engineering

Model NO.
Rigao PCB&PCBA
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Aluminum Covered Copper Foil Layer
Application
Consumer Electronics
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Delay Pressure Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Layout
1-22 Layer
Design,Size,Color
as Your Request
Payment
T/T,Western Union,Paypal,etc.
Lead Time
1-4 Weeks After Confirm The Design
Copper Thickness
as Your Request
Sample Order
Welcome
Packing List
Inner Vacuum Outer Carton. Carton Si
Board Thickness
1.6 Mm
Min. Line Spacing
0.12mm
Min. Hole Size
0.25mm
Trademark
Rigao PCBA
Transport Package
Vacuum Packing and Standard Carton
Specification
Shenzhen Rigao PCBA
Origin
Shenzhen, Guangdong
HS Code
8534009000

You Might Also Like