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Copper Clad Laminates for PCB, Xpc /Fr1/Fr2

China Copper Clad Laminates for PCB, Xpc/Fr1/Fr2, Find details about China Copper Clad Laminates, Copper Clad Laminate Sheet from Copper Clad Laminates for PCB, Xpc/Fr1/Fr2

Model NO.
XPC
Structure
Double-Sided Rigid PCB
Dielectric
FR-2
Material
Phenolic Paper Laminate
Application
Consumer Electronics
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Production Process
Additive Process
Base Material
Phenolic Paper
Insulation Materials
Organic Resin
Brand
Hjh
Trademark
HJH
Transport Package
Pallet
Specification
1030*1230MM
Origin
China
HS Code
7410211000

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