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Alumina Nitride (AlN) Substrates and Alumina (AS970) Substrates

China Alumina Nitride (AlN) Substrates and Alumina (AS970) Substrates, Find details about China Alumina Ceramic Substrate, Industrial Ceramic from Alumina Nitride (AlN) Substrates and Alumina (AS970) Substrates

Processing Technology
Delay Pressure Foil
Insulation Materials
Metal Composite Materials
Trademark
RY
Transport Package
Standard Plate Packing
Specification
According to customer request
Origin
China
HS Code
8547100000
Processing Technology
Delay Pressure Foil
Insulation Materials
Metal Composite Materials
Trademark
RY
Transport Package
Standard Plate Packing
Specification
According to customer request
Origin
China
HS Code
8547100000

High Density Alumina Ceramic substrate/ Plate
Alumina Nitride (AlN) Substrates and Alumina (AS970) Substrates
Alumina Nitride (AlN) Substrates and Alumina (AS970) Substrates
Alumina Nitride (AlN) Substrates and Alumina (AS970) Substrates



Supply alumina ceramic substrate:
Thickness: 0.3 - 2mm
Size: 10 - 300mm, According to drawing.

Laser Cutting ceramic substrate:
Cutting the highest accuracy: +/- 0.02mm
Cutting Maximum size: 152.4 x 152.4 mm
Cutting Minimum aperture diameter: 0.1mm
Cutting Maximum thickness: 1.5mm

 Data Sheet : 
 

Material85 Al2o390 Al2o395 Al2o399 Al2o3
Al2o385%90%93%99.30%
Fe2o3≤ 1.0≤ 0.5≤ 0.5≤ 0.3
Desnsity: g / cm33.43.53.63.85
Vickers Hardness≥ 8.6≥ 8.899
Water Absorption:%≤ 0.2≤ 0.1≤ 0.085≤ 0.01
Refractoriness:°C1580 °C1600 °C1650 °C1800°C
Flexural Strength:Mpa180200240280

Wear Rate( at room temperature, 

erosion, 100 grinding)%

≤ 3≤ 2.5≤ 1≤ 0.5
Test ItemsTechnical ParametersTest Conditions
Printing layer/Coating graphicKeep in conformity with the product drawing10 x microscope
Printing layer/Coating thicknessKeep in conformity with the product drawingX ray fluorescence thickness gauge
Drying-out resistanceNo defects on printing layer/ coating surface such as blisters, discolor, peelingHeating on heating board 300ºC/5min
Solder invasiveInvasive area≥95% 260±5ºC/5±1 Sec immersion tin
Soldering resistanceUnilateral adhered tin 75μm260±5ºC/10±1 Sec immersion tin
TensionPrinting layer >20gfWelding plate crossed φ130μm Cu
AdhesionNot strippingTape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec


Alumina Nitride (AlN) Substrates and Alumina (AS970) Substrates
 

 

1. Low MOQ:

   It won't occupy too much of your money to help you to test the market you're going to enter.

2. R & D Center and Factory:

   We have our own R & D center and factory, so we can supply you products at competitive price.

3. Good Service :

   We treat clients as friends.

4. Good Quality : 

   We import top quality accessories to manufacture our products, we have confident we can offer you the best quality.  

5. After-sales service: 

   One year's guarantee. Wearing accessories comes with the products to help you to reduce the repair bill.

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