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Test Items | Technical Parameters | Test Conditions |
Printing layer/Coating graphic | Keep in conformity with the product drawing | 10 x microscope |
Printing layer/Coating thickness | Keep in conformity with the product drawing | X ray fluorescence thickness gauge |
Drying-out resistance | No defects on printing layer/ coating surface such as blisters, discolor, peeling | Heating on heating board 300ºC/5min |
Solder invasive | Invasive area≥95% | 260±5ºC/5±1 Sec immersion tin |
Soldering resistance | Unilateral adhered tin 75μm | 260±5ºC/10±1 Sec immersion tin |
Tension | Printing layer >20gf | Welding plate crossed φ130μm Cu |
Adhesion | Not stripping | Tape cling to the surface with 3M#600, speed tear in the direction 90ºC after 30sec |