Products

Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin

China Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin, Find details about China BGA Reballing Kit Stencils, Reballing Stencils from Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin

Model NO.
705-0001164
Character
High Temperature Resistance
Production Process
CNC
Interface Type
N/a
Brand
Sireda
Package
BGA153
Pitch Size
0.5mm
IC Size
11.5X13X0.8mm
Material of Solder Kit
Al
BGA Reballing Service
Acceptable
Color
Red & Black
Certifacte
ISO9001
Keyword
BGA Reballing Stencil
Trademark
Sireda
Specification
80*80mm
Origin
Shenzhen, China
Model NO.
705-0001164
Character
High Temperature Resistance
Production Process
CNC
Interface Type
N/a
Brand
Sireda
Package
BGA153
Pitch Size
0.5mm
IC Size
11.5X13X0.8mm
Material of Solder Kit
Al
BGA Reballing Service
Acceptable
Color
Red & Black
Certifacte
ISO9001
Keyword
BGA Reballing Stencil
Trademark
Sireda
Specification
80*80mm
Origin
Shenzhen, China
1. Reball Tools
Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin


2. Re-balling process

1> Prepare IC to be re-balled;
 
2> Put an IC into IC Guide, take care of the A1 position;

3> Apply some solder paste to the Solder Paste Stencil;

4> Put Solder Paste Stencil onto IC Guide (already with a de-soldered & cleaned IC);

5> Use Solder Paste Blade to apply solder paste onto IC pads;

6> Remove Solder Paste Stencil from IC Guide;

7> Put some solder balls to Solder Ball Stencil;

8> Put Solder Ball Stencil onto IC Guide;

9>  Use Solder Ball Blade to gently press solder ball onto IC pads;

10> Take away the Solder Ball Stencil, and take out the Re-balled IC;

11> Put the re-balled IC to Reflow Oven or other Heating Device for soldering.



3. Rework Service

    1> Focus on precision BGA
Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin           Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin


    2> Features

      1. RoHS compliant
      2. Reasonable temperature curve ensure good reball
      3. ESD protection
      4. Residual tin in pad recess can be removed perfectly
      5. skilled technicians and mature process
      6. Our individual design of Reball kits & fixtures
 
Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin


4. Rework Process

Semiconductor Basic Rework Process
Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin


5. Relative Products
Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.
Part NumberDescriptionPackage 
705-0000931   BGA893 0.35mm SM8150 12.4x12.4mm C80 RDBKBGA893
705-0000932   BGA599 0.4mm MT6771 11x11.8mm C80 RDBKBGA599
705-0000936   BGA225 0.4mm MA2155  6.5x6.5mm C80 RDBKBGA225
705-0000941   BGA199 0.35mm PM6150 5.34x4.80mm C80 RDBKBGA199
705-0000942   BGA361 1.27mm SM91C142B 25x25mm C80 RBBGA361
705-0000943   BGA161 0.35mm PM8150 4.49x5.07mm C80 RDBKBGA161
705-0000945   BGA792 0.35mm SM7150 11.1x10.5mm C80 RDBKBGA792
705-0000946   BGA255 0.35mm SDR8150 5.5x6.51mm C80 RDBKBGA255
705-0000947   BGA302 0.35mm SDR8150 6.0x7.01mm C80 RDBKBGA302
705-0000948   BGA108  0.35mm PMX50 4.215x3.165mm C80 RDBKBGA108
705-0000949   BGA482 1.27mm 30.5x30.5mm C80  RDBKPGA482
705-0000950   BGA16 0.35mm PMK8002 1.4x1.4mm C80 RDBKBGA16
705-0000951   BGA806 0.35mm SDM6150 11.10x12mm C80 RDBKBGA806
705-0000952   BGA852  0.35mm SDX50M 11.0x11.40mm C80 RDBKBGA852
705-0000964   BGA65 0.65mm SC132GS 7.8x8.45mm C80 RDBKBGA65
705-0000971   BGA784 0.8mm NT90-N5386-1 23x23mm C80 RDBK BGA784
705-0000972   BGA839 0.4mm NT90-NB811-2 14x14mm C80 RDBK BGA839
705-0000981   BGA441 0.35mm MDM9635M 8.2x9mm C80 EDBKBGA441
705-0000986   BGA905 0.65mm  APQ8096AU  23x23mm C80 RDBKBGA905
705-0000987   BGA288 0.8mm PMM8996AU 13.8x13.8mm C80 RDBKBGA288
705-0000988   BGA24 0.8mm  RGR7640AU 4.4x4.4mm C80 RDBKBGA24
705-0000991   BGA144 0.35mm PM8150C 4.5x4.5mm C80 RDBKBGA144
705-0000992   BGA742 0.18mm QCA6390 5.978x5.798mm C80 RDBKBGA742
705-0000993   BGA42 0.4mm SMB1390 2.44x2.84mm C80 RDBKBGA42
705-0000994   BGA822 0.4mm SM6125  12x14mm C80 RDBKBGA822
705-0000995   BGA144 0.4mm PM6125 4.81x4.81mm C80 RDBKBGA144
705-0000996   BGA20 0.35mm  PM8008 1.51x1.84mm C80 RDBKBGA20
705-0000998   BGA200 0.8mm PMM6155AU 11.8x11.8mm C80 RDBKBGA200
705-0001000   BGA54 0.4mm P9320S 2.85x4.05mm C80 RDBKBGA54
705-0001001   BGA81 0.35mm MPB02 3.2x3.2mm C80 RDBKBGA81
705-0001002   BGA56 0.35mm S2DOSO5 2.9x3.05mm C80 RDBKBGA56
705-0001011   BGA761 0.8mm SA6155P 23x23mm C80 RDBKBGA761
705-0001014   BGA446 0.35mm PMB9960 8.92x7.28mm C80 RDBKBGA446
705-0001015   BGA351 0.30mm PMB5765  5.976x6.282mm C80 RDBKBGA351
705-0001016   BGA90 0.4mm PMB6840 3.657x4.057mm C80 RDBKBGA90
705-0001020   BGA491 0.4mm MT6739 11.8x11mm C80 RB BGA491
705-0001023  BGA456 1.0mm DGMA23456 23x23mm C80 RBBGA456
705-0001029   BGA558 0.4mm MT6762V 11x11.4mm C80 RB BGA558
705-0001030   BGA360 0.65mm 821672PO0A 13x13mm C80 RBBGA360
705-0001031   BGA489 0.65mm BCM11350 17x17mm C80 RBBGA489
705-0001032   BGA800 0.4mm NGTC5NM1 12x12.7mm C80 RBBGA800
705-0001033   BGA320 0.4mm NGTC5NM1 12x12.7mm C80 RBBGA320
705-0001034   BGA92 0.4mm 607C1V 4.1x4.1mm C80 RBBGA92
705-0001038   BGA726 0.40mm BCM11140IFEBG 14x14mm C80 RBBGA726
705-0001039   BGA758 0.65mm MSD6886NQHAT 20.2x20.2mm C80 RBBGA758
705-0001040   BGA56 0.45mm OPT8320NBP 5.32x8.03mm C80 RBBGA56
705-0001041   BGA144 0.8mm AD80404BBCZ 10x10mm C80 RDBKBGA144
705-0001042   BGA369 0.5mm H11S85N 11x11mm C80 RDBKBGA369
705-0001043   BGA177 0.4mm MDM9205 5.9x6.2mm C80 RDBKBGA177
705-0001045   BGA41 0.35mm QLN5020 2.50x2.50 mm C80 RDBKBGA41
705-0001046   BGA30 0.35mm QET6100 2.35x2.00 mm C80 RDBKBGA30
705-0001047   BGA683 0.35mm SDX55 8.80x10.50 mm C80 RDBKBGA683
705-0001048    BGA486 0.35mm SDR865 6.99x9.22 mm C80 RDBKBGA486
705-0001049   BGA547 0.35mm SDX55M 7.90x9.60 mm C80 RDBKBGA547
705-0001050   BGA135 0.35mm SMR526 4.00x4.89 mm C80 RDBKBGA135
705-0001051    BGA145 0.35mm PMX55 4.50x4.40 mm C80 RDBKBGA145
705-0001052    BGA58 0.35mm WCN3950 2.84x2.88 mm C80 RDBKBGA58
705-0001053   BGA110 0.35mm PM7250B 3.51x4.40mm C80 RDBKBGA110
705-0001054   BGA265 0.40mm QCA6391 6.85x6.85mm C80 RDBKBGA265
705-0001056   BGA1448 0.4mm SC8180X 15.0x20.0mm C80 RDBKBGA1448
705-0001057   BGA1099 0.35mm SM8250 12.40x14.00mm C80 RDBKBGA1099
705-0001058   BGA15 0.40mm PM3003A 2.01x1.21mm C80 RDBKBGA15
705-0001059   BGA60 0.35mm WCD9380/9385 3.12x3.00mm C80 RDBKBGA60
705-0001061   BGA945 0.35mm SM7250 11.1x12mm C80 RDBKBGA945
705-0001066   BGA12 0.4mm QET4101 1.28x1.58mm C80 RDBKBGA12
705-0001067   BGA111 0.4mm  QCC1110 4x5.2mm C80 RDBKBGA111
705-0001068   BGA63 0.4mm SDR105 2.98x4.64mm C80 RDBKBGA63
705-0001069   BGA49 0.4mm  PME9205 2.85x2.89mm C80 RDBKBGA49
705-0001070   BGA144 0.35mm PMC8180C 4.49x4.47mm C80 RDBKBGA144
705-0001073   BGA369 0.65mm H22S86 14x14mm C80 RDBKBGA369
705-0001074   BGA34 0.35mm QET6110 2.30x2.34mm C80 RDBKBGA34
705-0001075   BGA88 0.4mm QTC800H 3.36x4.79mm C80 RDBKBGA88
705-0001078   BGA1017 0.35mm SM8250 BOT 12.4x12.7mm C80 RDBKBGA1017
705-0001079   BGA556 0.4mm SM8250 TOP 12.4x12.7mm C80 RDBKBGA556
705-0001080   BGA352 1.27mm SMQV300  35x35mm C80 RDBKBGA352
705-0001084   BGA17 0.4mm WGR7640  2.07x1.51mm C80 RDBKBGA17
705-0001088   BGA256 1.0mm HWD7512AE 17x17mm C80 RDBKBGA256
705-0001089   BGA809 0.35mm SM6250 10.5x11.1mm C80 RDBK BGA809
705-0001096   BGA162 0.5mm eMCP 8x10.5mm C80 RDBK 4eaBGA162
705-0001099   BGA1265 0.8mm MSD95VDH01 31x31mm C80 RDBKBGA1265
705-0001100   BGA583 0.8mm MSD6A848BQ 20.2x20.2mm C80 RDBKBGA583
705-0001101   BGA328 0.35mm MDM9207 6.9x7.8mm C80 RDBK 2eaBGA328
705-0001102   BGA1310 0.65mm EY82C622 28x34mm C80 RDBKBGA1310
705-0001106   BGA672 0.8mm HI3750 27x27mm C80 RDBKBGA672
705-0001107   BGA977 0.35mm MT6885Z 12.4x12.4mm C80 RDBKBGA977
705-0001113   BGA338 0.35mm MT6190 6.66x6.97mm C80 RB 2eaBGA338
705-0001114   BGA146 0.35mm MT6186W 4.8x5.3mm C80 RB 2eaBGA146
705-0001122   BGA144 0.4mm MT6177 5x5.4mm C80 RB 2eaBGA144
705-0001124   BGA1001 0.65mm MT5813QFIQ 23x23mm C80 RDBKBGA1001
705-0001125   BGA802 0.8mm MT5812QGEJ 27x27mm C80 RDBKBGA802
705-0001129   BGA462 0.65mm MT9632FAATAB 19X19mm C80 RDBKBGA462
705-0001131   BGA932 0.4mm MT6799 14x14mm C80 RDBKBGA932
705-0001133   BGA24 1mm S024BA03 6x8mm C80 RDBKBGA24
705-0001137   BGA780 1.0mm 29x29mm C80 RDBKBGA780
705-0001142   BGA96 0.8mm 9x13.5mm C80 RDBKBGA96
705-0001143   BGA324 0.8mm 15.1x15.1mm C80 RDBKBGA324
705-0001144   LGA48 0.4mm 6.15x6.15mm C80 RDBKLGA48
705-0001145   BGA506 0.35mm SDX20 8.4x9.2mm C80 RDBKBGA506
705-0001146   BGA253 0.35mm SDR845 6.12x6.43mm C80 RDBKBGA253
705-0001148   BGA456 0.35mm LPDDR 14x15.5mm C80 RDBKBGA456
705-0001150   BGA49 0.5mm 3.594x3.984mm C80 RDBKBGA49
705-0001151   BGA888 0.8mm MB8AE1110RBB 31x31mm C80 RDBKBGA888
705-0001152   BGA406 0.8mm SMD6A346ATT 17.5x17.5mm C80 RDBKBGA406
705-0001157   BGA172 0.4mm QC6174A 4.89x6.02mm C80 RDBKBGA172
705-0001162   BGA100 1.0mm eMMC 14x18x1mm C80 RDBKBGA100
705-0001163   BGA136 0.5mm eMCP 10x10x0.8mm C80 RDBKBGA136
705-0001164   BGA153 0.5mm eMMC 11.5x13x0.8mm C80 RDBKBGA153
705-0001165   BGA169 0.5mm eMMC 12x16x0.8mm C80 RDBKBGA169
705-0001166   BGA162 0.5mm eMCP 11.5x13x1mm C80 RDBKBGA162
705-0001167   BGA186 0.5mm eMCP 12x16x1mm C80 RDBKBGA186
705-0001168   BGA221 0.5mm eMCP 11.5x13x1mm C80 RDBKBGA221
705-0001169   BGA254 0.5mm eMCP 11.5x13x0.7mm C80 RDBKBGA254
705-0001170   BGA280 0.45mm eMCP 14x14.5x0.8mm C80 RDBKBGA280
705-0001171   BGA529 0.5mm eMCP 15x15x0.7mm C80 RDBKBGA529
705-0001172   BGA134 0.65mm LPDDR2 10x11.5x0.9mm C80 RDBKBGA134
705-0001173   BGA216 0.4mm LPDDR2 12x12x0.6mm C80 RDBKBGA216
705-0001174   BGA240 0.5mm LPDDR2 14x14x0.48mm C80 RDBKBGA240
705-0001175   BGA168 0.5mm LPDDR3 12x12x0.65mm C80 RDBKBGA168
705-0001176   BGA178 0.65mm LPDDR3 10.5x11.5x0.56mm C80 RDBKBGA178
705-0001177   BGA216 0.5mm LPDDR3 15x15x0.45mm C80 RDBKBGA216
705-0001178   BGA296 0.35mm LPDDR3 14x14x0.7mm C80 RDBKBGA296
705-0001179   BGA426 0.35mm LPDDR3 13.5x14.5x0.38mm C80 RDBKBGA426
705-0001180   BGA200 0.65mm LPDDR4 11x14.5x0.52mm C80 RDBKBGA200
705-0001181   BGA366 0.50mm LPDDR4 15x15x0.4mm C80 RDBKBGA366
705-0001182   BGA556 0.4mm LPDDR4 12.4x12.4mm C80 RDBKBGA556
705-0001183   BGA496 0.4mm LPDDR5 12.5x14x0.5mm C80 RDBKBGA496
705-0001184   BGA989 0.6mm V926E831 25x25mm C80 RDBKBGA989
705-0001192   BGA898 0.4mm HI3690 14x14mm C80 RDBKBGA898

Company Profile

Rework Service BGA153 Emmc Reball Kit for Removing Residual TinSireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.

Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.


Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.
 
Certifications

Quality Management System-ISO 9001:2015, National High Technology Expertise, US Patent, Industrial Design, Patent for Utility Model etc.
Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin

Sireda has been authorized as National High Technology Expertise.

Sireda Technology Co., Ltd focuse on semiconductor test & rework solutions. Since established in 2010, we keep developing technology in IC test device, ATE test solution and provide fast & good test solution to customers worldwide.

Sireda is highly recognized by industry professionals as a company with growth potential.
 
Our Advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.
 
Our Exhibition and Customers

Rework Service BGA153 Emmc Reball Kit for Removing Residual Tin


 

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