China Clamshell Emmc BGA153 SD Test Socket for Chipoff Data Recovery, Find details about China Emmc Socket, Emmc BGA SD Adapter from Clamshell Emmc BGA153 SD Test Socket for Chipoff Data Recovery
Mechanical | |
Material Socket Body | PPS |
Material Socket Lid | AL, Cu, PEI |
Contact | Pogo Pin |
Operation Temperature | 0 ~ 80 ºC |
Life Span | 50K Cycles |
Spring Force | 20g ~ 30g per Pin |
Electrical | |
Current Rating | 1.0A~2.0A |
DC Resistance | Max. 100mΩ |
Part Number | Description | IC Chip Type |
702-0000848 | BGA153 0.5mm eMMC CS125 11.5X13mm SD B0 BA | With solder ball |
702-0000850 | BGA153 0.5mm eMMC CS125 11.5X13mm SD B0 NB | Without solder ball |
702-0001059 | BGA153 0.5mm eMMC CS125 11x10mm SD B0 BA | With solder ball |
702-0001061 | BGA153 0.5mm eMMC CS125 11x10mm SD B0 NB | Without solder ball |
702-0001063 | BGA169 0.5mm eMMC CS125 12x16mm SD B0 BA | With solder ball |
702-0001065 | BGA169 0.5mm eMMC CS125 12x16mm SD B0 NB | Without solder ball |
702-0001067 | BGA169 0.5mm eMMC CS125 12x18mm SD B0 BA | With solder ball |
702-0001069 | BGA169 0.5mm eMMC CS125 12x18mm SD B0 NB | Without solder ball |
702-0001071 | BGA169 0.5mm eMMC CS125 14x18mm SD B0 BA | With solder ball |
702-0001073 | BGA169 0.5mm eMMC CS125 14x18mm SD B0 NB | Without solder ball |
702-0000857 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0000859 | BGA162 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0000873 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 BA | With solder ball |
702-0000875 | BGA162 0.5mm eMCP CS125 12x13.5mm SD B0 NB | Without solder ball |
702-0000865 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 BA | With solder ball |
702-0000867 | BGA186 0.5mm eMCP CS125 12x16mm SD B0 NB | Without solder ball |
702-0000899 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001037 | BGA221 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0000976 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 BA | With solder ball |
702-0001035 | BGA100 1.0mm eMMC CS125 14x18mm SD B0 NB | Without solder ball |
702-0001315 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 NB | Without solder ball |
702-0001326 | BGA136 0.5mm eMMC CS125 10x10mm SD B0 BA | With solder ball |
702-0000828 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 BA | With solder ball |
702-0000830 | BGA529 0.5mm eMCP CS125 15x15mm SD B0 NB | Without solder ball |
702-0001028 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 BA | With solder ball |
702-0001040 | BGA254 0.5mm eMCP CS125 11.5x13mm SD B0 NB | Without solder ball |
702-0001586 | BGA254 0.5mm eMCP CS125 12x15mm SD B0 NB | Without solder ball |
702-0001587 | BGA280 0.45mm eMCP CS125 14x14.5mm SD B0 NB | Without solder ball |
702-0001685 | BGA153+162+221 0.5mm CS125 3 in1 SD B0 NB | Without solder ball |
Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.
Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.
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As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.
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Technical Support | We have a professional R & D team and all the engineers have more than 5 years' experience. So we have the ability to design and produce best products according to our customers' requirements. |
Best Service | We provide inquiry and consulting & technical support for both pre-sale and after sale. Strictly quality control is in each production process. Our team are keep helping our customers to solve their problems anytime if needed. |