Burn in Socket BGA153 Emmc Molded with Competitive Price

China Burn in Socket BGA153 Emmc Molded with Competitive Price, Find details about China with USB3.0 Interface, for IC HS400 from Burn in Socket BGA153 Emmc Molded with Competitive Price

Model NO.
701-0000092
Character
High Temperature Resistance
Production Process
Injection Molding
Interface Type
USB
Brand
Sireda
Pin Count
153
Pitch
0.5mm
Contact
Spring Probe
Package
BGA
Test Type
HS400
Controller
Gl3227e
IC Size
11.5X13mm
Socket Type
Molded
Trademark
Sireda
Transport Package
Carton
Specification
BGA153
Origin
Shenzhen, China
Model NO.
701-0000092
Character
High Temperature Resistance
Production Process
Injection Molding
Interface Type
USB
Brand
Sireda
Pin Count
153
Pitch
0.5mm
Contact
Spring Probe
Package
BGA
Test Type
HS400
Controller
Gl3227e
IC Size
11.5X13mm
Socket Type
Molded
Trademark
Sireda
Transport Package
Carton
Specification
BGA153
Origin
Shenzhen, China
1. Product Description
Burn in Socket BGA153 Emmc Molded with Competitive Price

BGA153 eMMC USB Card Reader

1. Suitable for eMMC and eMCP devices of Samsung, Hynix, Sandix, Toshiba, Intel, Kingston etc.
2. Support for various eMMC version.
3. Support hot plug, eMMC can be directly connected to PC with USB port.
4. Realize reading, accessing and writing data for the eMMC and eMCP devices.
5. Socket clam with rolling design makes it easy operation, less abration, so as to longer life span.



2. Parameters
Mechanical
Material Socket BodyPEI
Material Socket LidPEI
ContactPogo Pin
Operation Temperature-0 ~ 80 ºC
Life Span50K Cycles
Spring Force20g ~ 30g per Pin
Electrical
Current Rating1.5A
DC Resistance<100mΩ@0.65mm



3. Product Drawing
                             Burn in Socket BGA153 Emmc Molded with Competitive Price

 
1. CS100 B  2. Round Head Screw3. Guide Frame4. Magnet5. Alignment Pin6. Top Guide 
7. Slotted Head Screw8. Pogo Pin9. Bottom Guide10. Straight Grain Nut11. Alignment Pin12.Allignment Pin

 

4. Specification
 

BGA153 Molded Socket 

Part No.: 701-0000092

 

IC Size: 11.5X13mm

Package:  BGA153

                      Burn in Socket BGA153 Emmc Molded with Competitive Price


5. Relative Products
Here it only shows a selection of sockets, for customized or other type, please have look at our website: siredatech.en.made-in-china.com.
Part NumberDescriptionTypeController
702-0001327BGA153 0.5mm eMMC CS100 11.5x13mm HS400 USBHS400GL3227E
702-0001328BGA162 0.5mm eMCP CS100 11.5x13mm HS400 USBHS400GL3227E
702-0001329BGA221 0.5mm eMCP CS100 11.5x13mm HS400 USBHS400GL3227E
702-0001330BGA254 0.5mm eMCP CS100 11.5x13mm HS400 USBHS400GL3227E
702-0001331BGA153 0.5mm UFS CS100 11.5x13mm USBUFSSM3350
702-0001674BGA153 0.5mm UFS CS100 11.5x13mm USBUFSJMS901
701-0000092BGA153 0.5mm eMMC CS100 11.5x13mm HS400 USBHS400GL3227E
701-0000093BGA162 0.5mm eMCP CS100 11.5x13mm HS400 USBHS400GL3227E
701-0000094BGA221 0.5mm eMCP CS100 11.5x13mm HS400 USBHS400GL3227E
701-0000095BGA254 0.5mm eMCP CS100 11.5x13mm HS400 USBHS400GL3227E
701-0000096BGA153 0.5mm UFS CS100 11.5x13mm USBUFSSM3350
701-0000150BGA153 0.5mm UFS CS100 11.5x13mm USBUFSJMS901



6. Company Profile
Burn in Socket BGA153 Emmc Molded with Competitive Price
Sireda Technology Co.,Ltd established in Shenzhen, China in 2010, focused on semiconductor test & rework solutions.


Our products include : Standard test solution, standard test socket &jigs, customized sockets, Jig& Automation, FA support, Rework solutions, rework services.

Be the world's leading socket supplier
As an IC testing socket supplier, we focus on Semiconductor Testing Research and Innovations, has Achieved a lot of Patents. And also get the certificate of National High-tech.

Create value for our customers
We are committed to provide the most competitive price, highest quality, best custom design, shortest lead time, and most professional service for our customer all over the world. Work closely with customer and enable them to achieve greater manufacturing efficiency and productivity.



7. Our advantages
No MOQNo MOQ limitation here.
Our cooperation can begin with the sample and provide quality assurance to you before mass production.
High Cost PerformanceWe provide products with high quality and competitive price.
Technical SupportWe have a professional R & D team and all the engineers have more than 5 years' experience.
So we have the ability to design and produce best products according to our customers' requirements.
Best ServiceWe provide inquiry and consulting & technical support for both pre-sale and after sale.
Strictly quality control is in each production process.
Our team are keep helping our customers to solve their problems anytime if needed.



8. Contact us
   Burn in Socket BGA153 Emmc Molded with Competitive PriceShenzhen Sireda Technology Co., Ltd.
AddArea A,Floor 6, Building 4, the 10th Industry Park, GuangMing District,Shenzhen 518132

We provide products with good quality and fast response, also provide customized service.
If you like to learn more about us, please have a look at our website: siredatech.en.made-in-china.com.