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Multilayer HDI Fr4 PCB Board

China Multilayer HDI Fr4 PCB Board, Find details about China PCB, PCB Board from Multilayer HDI Fr4 PCB Board

Model NO.
PCB
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Ibe
Service
PCB Circuit Board for Medical Device
Certificates
UL, ISO13485, Ts16949
Min.Line Spacing
0.1mm (4 Mil)
Min.Hole Size
0.1mm (4 Mil)
Copper Thickness
1oz
Board Thickness
1.0mm, 1.2mm, 1.6mm
Layer
Single/Double Layer/Multilayer
Products Name
Multilayer HDI PCB Board
Trademark
IBE
Transport Package
Vacuum Packing
Specification
256*182MM
Origin
China
HS Code
8534009000
Model NO.
PCB
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Ibe
Service
PCB Circuit Board for Medical Device
Certificates
UL, ISO13485, Ts16949
Min.Line Spacing
0.1mm (4 Mil)
Min.Hole Size
0.1mm (4 Mil)
Copper Thickness
1oz
Board Thickness
1.0mm, 1.2mm, 1.6mm
Layer
Single/Double Layer/Multilayer
Products Name
Multilayer HDI PCB Board
Trademark
IBE
Transport Package
Vacuum Packing
Specification
256*182MM
Origin
China
HS Code
8534009000
PCB capacity
Product nameMultilayer HDI PCB Board and PCB Circuit Board for Medical Device
Layer No.2-16L
MaterialFR-4; High TG FR-4; Aluminum; CEM-1; CEM-3;  Rogers, etc
Max board size610*460mm
Tolerance of board NPTH hole size+/-0.05mm
Tolerance of board PTH hole size+/-0.076mm
Surface finishHASL, LF HASL, Imm Gold, Imm Silver, OSP etc
Solder maskGreen, red, white, yellow, blue, black
Min.line width/Space
3/4mil
Finished Thickness
0.2mm~6.0mm
Max. Copper
8 oz
Min. Drill
0.1mm
Min. PTH Slot Width
0.50mm
Aspect Ratio
15:1
Min. Solder Opening Single Side
1.5mil
HDI
3+N+3
Delivery timeMass: 10-12D   Sample:5-7D
Impedance Tolerance
±8%
Special Technology
Edge Metallization,Half hole,Back Drill,Photovoltaic board,Mechnical HDI,Mixed Compression High Frequency,
Laser Drill HDI,Cross HDI,Al base,Copper base,BI base,Rigid-flex,Embedded Capacitor,Thermister board

PCBA capacity
Stencil size range1560*450mm
Min. SMT package0201
Min. IC pitch0.3mm
Max.PCB size1200*400mm
Min. PCB thickness0.35mm
Min. Chip size01 005
Max. BGA size74*74mm
BGA ball pitch0.4 to 1.0mm
BGA ball diameter0.45 to 0.76mm
QFP lead pitch0.38 to 2.54mm

Product display
 
Multilayer HDI Fr4 PCB Board
Multilayer HDI Fr4 PCB Board
Multilayer HDI Fr4 PCB Board
Multilayer HDI Fr4 PCB Board


About us
IBE has been serving the contract manufacturing (OEM/EMS) industry nearly 20 years in China. The service includes Electronic Design , PCB Fabrication, SMT and PCB Assembly, Components Sourcing, Prototyping, Box Build, and Turnkey Solution.To expand the business and provide better services to North American customers, IBE opened a new facility IBE (USA) in Hillsboro, OR in 2017, which can provide a full range of PCB assembly service. IBE continues to invest in new technologies, providing a complete manufacturing solution to meet customers' needs and make the process more economical. Our major products are in markets of automotive, medical device, security device, optic, Power Charging Electronic Device, Digital Earphone,etc.

Application Field
Multilayer HDI Fr4 PCB Board
PCB facilities
Multilayer HDI Fr4 PCB Board
Honors & Certificates
ISO 9001 certificated;
ISO 14001 certificated;
UL certificated: E326838;
IPC members
TS 16949 certificated
ISO 13485 certificated;
FAMA Certificated for Disney products
MES (Manufacturing Execution System)
Multilayer HDI Fr4 PCB Board

Our advantages
Multilayer HDI Fr4 PCB Board

A great day to you, if you have any demand on PCB or PCBA assembly, pls contact us for details, we will check for you at any time.





 

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