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Intel Single Board Computer Core I3 Terminal Multi-Media Motherboard

China Intel Single Board Computer Core I3 Terminal Multi-Media Motherboard, Find details and Price about China Core I3 Motherboard, Intel Single Board Computer Motherboard from Intel Single Board Computer Core I3 Terminal Multi-Media Motherboard

Model NO.
hm77
CPU Socket
LGA 1155
Printed Circuit Board
Four Layers
Main Board Structure
Integrated
Audio Effects
Not HiFi
Bois
Ami EMI 32MB SMT/DIP-Spi Flash ROM
Name
3.5 Inch Embedded Motherboard Intel Core I3
OS
Windows 2000, XP, Linux, Win Ce/XPE
Capacity
DDR3 So-DIMM Socket, Maximum up to 8GB
Graphics
Intel HD Graphics
Lvds
Dual Channel 24bit Lvds
COM
6 COM
Network
2 LAN
Trademark
PIESIA
Transport Package
Carton Gift Box
Specification
115*155mm
Origin
China
HS Code
8473309000
Model NO.
hm77
CPU Socket
LGA 1155
Printed Circuit Board
Four Layers
Main Board Structure
Integrated
Audio Effects
Not HiFi
Bois
Ami EMI 32MB SMT/DIP-Spi Flash ROM
Name
3.5 Inch Embedded Motherboard Intel Core I3
OS
Windows 2000, XP, Linux, Win Ce/XPE
Capacity
DDR3 So-DIMM Socket, Maximum up to 8GB
Graphics
Intel HD Graphics
Lvds
Dual Channel 24bit Lvds
COM
6 COM
Network
2 LAN
Trademark
PIESIA
Transport Package
Carton Gift Box
Specification
115*155mm
Origin
China
HS Code
8473309000
Advantage:
1.Embedded high performance industrial motherboard. (2.0cm ultrathin)
2.DDR3 1066/1333/1600MHz memory,SO-DIMM socket maximum up to 8GB.
3.Support WIFI,3G SIM card,dual 1000M RJ45 LAN port,support Mini SATA ,more efficiency.
4.Support power booting/plug and play,Timer-power-on.
5.Support 1080P HDMI resolution maximum up to:1920*1200;Support 24bit dual channel LVDS;VGA resolution maximum up to:2048*1536.
6.Reliable, High stability, Low noise, low power consumption.Perfectly suitable for AD Player/AIO machine/IPC/VOD/Car PC/HTPC etc.
7.Certificate:CE,FCC,RoHS
 
                                                   Main Features
Suitable forAD Player;AIO machine; Thin Client; Firewall;Car PC;HTPC;VOD; IPC; POS etc.
Form Factor3.5 Inch 115mm×155mm×20mm
Chipset ManufacturerIntel
CPUIntel Core3 i7/i5/i3 processors optional;default I3-2310M (3M Cache, 2.10 GHz)
ChipsetIntel® HM77 Express Chipset
L2 Cache3MB, CPU integrated
BIOSAMI EMI 32MB SMT/DIP-SPI Flash ROM
RAMDDR3 1066/1333/1600MHz memory,SO-DIMM socket,maximum up to 8GB
Integrated GraphicsIntel HD Graphics ( requires compatible CPU with built-in GPU )
SoundOnboard Realtek HD ALC662 chipset(Line in/out/Mic),onboard power amplifier.
NetworkRTL8111EL PCI-E Gigabit Ethernet LAN,support RTL/PXE diskless booting
Storage2*SATA;1*mSATA
LVDSSupport 24bit dual channel LVDS connector.Resolution maximum up to:1920*1200
USB6*USB 3.0/2.0/1.1(2 external;4 expansion header)
Expansion Sockets1*Mini SATA socket;1*Mini-PCIE socket for WIFI;1*SIM card slot for 3G
 
 
rear panel I/O		1*12V -DC power supply
1*HDMI
1*VGA port
2*USB 2.0/1.1 port
2*1000M RJ45 port
2*Audio I/O interfaces( Line in,Line out,Mic)
 
 
 
 
 
Internal I/O		4*USB 2.0/1.1 expansion header
2*CPU/SYS Chassis fan connectors
1*Audio I/O expansion header
6*COM expansion headers (support RS232/422/485)
1*GPIO expansion header(8 group)
1*VGA expamsion header
1*HDMI expansion header
1*Audio power amplifier
1*LPT expansion header
Power Interface4PIN,ATX power supply
Working Temperature-20°C~70°C (-4°F~158°F)
Storage Temperature-20°C~80°C (-4°F~176° )
Operating Humidity

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