Ceramic Bond Grinding Wheels

China Ceramic Bond Grinding Wheels, Find details about China Diamond Grinding Wheels, PCD Wheels from Ceramic Bond Grinding Wheels

Model NO.
Diameter 50mm~500mm
Trademark
HG
Origin
China
HS Code
6804221000
Model NO.
Diameter 50mm~500mm
Trademark
HG
Origin
China
HS Code
6804221000
Ceramic Bond Grinding Wheels 

Ceramic Bond Grinding Wheels


1.Ceramic bond diamond grinding wheel
Appliable material: Semiconductor wafers and solar wafers, PCD (drill bits),CVD,PCBN,tungsten carbide,engineering structural ceramics,gem,crystal,magnetic material and other hard and brittle material.
Ceramic Bond Grinding WheelsCeramic Bond Grinding Wheels
2.Resin bond diamond grinding wheel
Appliable material :Non metallic materials,tungsten carbide, ceramic, agate, optical glass, semiconductor materials,cast iron,stone and so on.
Ceramic Bond Grinding WheelsCeramic Bond Grinding Wheels
3.Metal bond diamond grinding wheel
Appliable material:Glass,ceramic,silicon wafer,floor slab,marble,granite,concrete,semiconductor materials and super hard materials.
Ceramic Bond Grinding WheelsCeramic Bond Grinding Wheels
4.Features
Good for non metallic materials.
High efficiency and low consumption.
High accuracy.
Good thermal conductivity.
Good self-sharpening.
Less heat in grinding, fewer burned workpiece.
Predictable quality and shape for the workpiece.
Ceramic Bond Grinding WheelsCeramic Bond Grinding WheelsCeramic Bond Grinding Wheels