General Insulating Epoxy Resin Glue for Electronic Components, Quality Assurance Potting Glue

China General Insulating Epoxy Resin Glue for Electronic Components, Quality Assurance Potting Glue, Find details about China Adhesive, Metal Liquid Resin from General Insulating Epoxy Resin Glue for Electronic Components, Quality Assurance Potting Glue

Basic Info.

Method

Brush

Drying Method

Heat Curing

Certification

ISO14001, CCC, RoHS, ISO9001, UL

Substrate

Ceramic

Components

Epoxy

Application

Metal, Ceramic, Glass, Fiber, Wood, Electronic COM

Another Name

Electrician Epoxy Resin

Advantage

Suitable High Temperature Climate

Package

Bottle

MOQ

15kg

Viscosity

1500cps

Classification

Two-Component Adhesive

Material

Pure Epoxy Resin

Certificate

SGS

Use Range

Electronic Components Ceramic Metal Fiber Glass Wo

Operating Temperature

200 Degrees

Trademark

Boqiao

Transport Package

Bottle

Origin

Guangdong, China

HS Code

3506912000

Method

Brush

Drying Method

Heat Curing

Certification

ISO14001, CCC, RoHS, ISO9001, UL

Substrate

Ceramic

Components

Epoxy

Application

Metal, Ceramic, Glass, Fiber, Wood, Electronic COM

Another Name

Electrician Epoxy Resin

Advantage

Suitable High Temperature Climate

Package

Bottle

MOQ

15kg

Viscosity

1500cps

Classification

Two-Component Adhesive

Material

Pure Epoxy Resin

Certificate

SGS

Use Range

Electronic Components Ceramic Metal Fiber Glass Wo

Operating Temperature

200 Degrees

Trademark

Boqiao

Transport Package

Bottle

Origin

Guangdong, China

HS Code

3506912000

Product Desciption

Port
Guangzhou
Lead Time:

Quantity(Kilograms)	1 - 10000	>10000
Est. Time(days)	15	To be negotiated

Performance before curing

Performance	unit	Glue A	Glue B
Exterior	---	Colorless transparent liquid	Colorless, light yellow, liquid
density	25ºC,g/cm³	1.05-1.08	0.92-1.02
Viscosity	25ºC,mPa.s	7000-8500	100-400
It is recommended to wear protective equipment such as gloves, masks and goggles during use. In order to achieve the best performance of the product, prepare weighing during use.

Performance after curing

project	unit	Measurements
hardness	SHORE-D	90±3
Volume resistivity	25ºC,Ω.cm	>1.35*10¹⁵
Surface resistivity	25ºC,Ω	>1.2*10¹⁴
Dielectric strength	25ºC,Kv/mm	>25
Dielectric constant	----	4.80-5.30
Dielectric loss	τδ	0.03-0.05
Tensile Strength	MPa	55-77
Bending strength	MPa	95-110
Glass transition temperature	ºC	100-110

Note: The above performance data is based on standard curing process testing and is for customer reference only. It cannot be fully guaranteed that all the above data will be achieved in a specific environment. Please refer to the actual measured data when using it.

About potting

Ratio: A:B=100:80 (note that the weight ratio is not the volume ratio)
A/B is a two-component epoxy system with low viscosity, good fluidity, and good leveling. It has the following characteristics:
1. This product is transparent and slightly yellow, full transparent color, epoxy potting glue, low viscosity, good fluidity, and easy to penetrate into the gap of the product.
2. No curing at room temperature, early stage: heating at 80-90 degrees, 2-3 hours, late stage: 100-115 degrees, curing for 3-5 hours.
3. No bubbles after curing, smooth surface, good gloss, high pressure resistance, high temperature resistance and high hardness.

Four characteristics are waiting for you