Black Elastic Glue Thermal Conductivity Ab Silicon Potting Glue Power Supply Thermal Conductivity Insulating Sealant
China Black Elastic Glue Thermal Conductivity Ab Silicon Potting Glue Power Supply Thermal Conductivity Insulating Sealant, Find details about China Adhesive, Metallic Floor from Black Elastic Glue Thermal Conductivity Ab Silicon Potting Glue Power Supply Thermal Conductivity Insulating Sealant
Basic Info.
Model NO.
YH-9012A
Method
Brush
Level
Finish Coat
Drying Method
Air Drying
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Components
Epoxy
Formation Mechanism
Conversion Type
Application
Sealing Construction
Another Name
Epoxy Adhesive
Advantage
Suitable High Temperate Climates
Package
Bottle
MOQ
1kg
Viscosity
2000-3000cps
Type
Two Component
Classification
Double Components Adhesives
Usage
Electronic Component
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
Model NO.
YH-9012A
Method
Brush
Level
Finish Coat
Drying Method
Air Drying
Certification
ISO14001, CCC, RoHS, ISO9001, UL
Components
Epoxy
Formation Mechanism
Conversion Type
Application
Sealing Construction
Another Name
Epoxy Adhesive
Advantage
Suitable High Temperate Climates
Package
Bottle
MOQ
1kg
Viscosity
2000-3000cps
Type
Two Component
Classification
Double Components Adhesives
Usage
Electronic Component
Keywords
Epoxy Resin Liquid
Material
Pure Epoxy
Trademark
Boqiao
Transport Package
Bottle
Origin
China
HS Code
3506912000
Product Desciption
Packaging & Delivery
Port
Guangzhou
Lead Time:
Guangzhou
Lead Time:
| Quantity(Kilograms) | 1 - 10000 | >10000 |
| Est. Time(days) | 15 | To be negotiated |
Moderate mixing viscosity: Addition molding high thermal conductivity silicone potting compound, low viscosity, good fluidity, easy to penetrate into the product gap.
Long operation time: The operation time is long after the two groups A and B are mixed.
Easy to repair: no air bubbles on the surface, smooth surface, good insulation and heat conduction, and the product is easy to repair.
product information
product name: Addition molding high thermal conductivity silicone potting glue
Product specifications: A-500g B-50g
Product specifications: A-500g B-50g
| Performance | A component | B component | |
| Before curing | Exterior | Black or gray viscous liquid | Colorless or slightly yellow transparent liquid |
| Viscosity (cps) | 5000±500 | ||
| density | 1.5±2 | 1±0.5 | |
| A component: B component (weight ratio) | 10:1 | ||
| After curing | Dielectric constant | 3.0-3.3 | |
| hardness | 50±3 | ||
| Thermal Conductivity | ≥0.5 | ||
| Dielectric strength | ≥15 | ||
| Volume resistivity | ≥1.0*1016 | ||
| Shelf life 25ºC | 6 months | ||
| Operation time (min) | 15-25 | ||
Factory Supplying Black Granite Surfboard Resin Epoxy Resin For Electronics
Product Description
Product Description
| Instructions |
| APPLICATION |
| Packing |
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