China Thermal Conductivity Aluminium Nitride Aln Substrate, Find details about China Aluminium Nitride Aln Substrate, Aluminum Nitride Ceramic from Thermal Conductivity Aluminium Nitride Aln Substrate
Thermal conductivity Aluminium Nitride AlN substrate is our main product.
Thermal conductivity Aluminium Nitride AlN substrate high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications.
Thermal conductivity Aluminium Nitride AlN substrate Usage:
Thermal stability up to at least 1800°C
Favorable mechanical characteristics extending into the high temperature range.
Low thermal expansion and resistance to thermal shock.
Special optical and acoustic characteristics.
Unusually high thermal conductivity combined with good electrical insulation characteristics.
Exceptional stability when exposed to many molten salts.
Thermal conductivity Aluminium Nitride AlN substrate Physical Properties
Flexural strength is 300 ± 5MPa
Coefficient of thermal expansion is 5.6x10-6K-1 (20-1000°C)
Thermal conductivity is 100-200 Wm-1K-1
Insulation resistance is >1012Ωcm (20°C)
Thermal conductivity Aluminium Nitride AlN substrate package and delivery