High Thermal Aluminum Nitride Ceramic Disc AlN Substrate 

High Thermal Aluminum Nitride Ceramic Disc AlN Substrate is our main product.

High Thermal Aluminum Nitride Ceramic Disc AlN Substrate high thermal conductivity with strong electrical resistance, making AlN an excellent solution for many electronic applications. 

High Thermal Aluminum Nitride Ceramic Disc AlN Substrate Usage:
Thermal stability up to at least 1800°C
Favorable mechanical characteristics extending into the high temperature range.
Low thermal expansion and resistance to thermal shock.
Special optical and acoustic characteristics.
Unusually high thermal conductivity combined with good electrical insulation characteristics.
Exceptional stability when exposed to many molten salts.

High Thermal Aluminum Nitride Ceramic Disc AlN Substrate Physical Properties
Flexural strength is 300 ± 5MPa
Coefficient of thermal expansion is 5.6x10-6K-1 (20-1000°C)
Thermal conductivity is 100-200 Wm-1K-1
Insulation resistance is >1012Ωcm (20°C)

High Thermal Aluminum Nitride Ceramic Disc AlN Substrate package and delivery

Delivery time: if in stock, send in 3-5 days, if do not have in stock. about 20-30 days.

About Us

Zhengzhou Mission Ceramic Products Co., Ltd. Locates in Zhenzhou City, Henan Province, central part of China. We have been working in advanced ceramic and thermal industry since 2013. Our products has been exported to more than 40 countries like USA, UK, Russia, France, Australia Korea etc. We win good reputation from customers because of good quality and service.

1. Alumina ceramic products, including tubes, rods, crucibles, plates, and other part made by your Design.
2. Zirconia Ceramic products, including tubes, crucibles, plates and other parts as you need.
3. Silicon carbide ceramic products, including beams, plates, tubes, crucibles etc.
4. Boron nitride ceramic products, including plates, crucible, and other parts as you need.
5. Alumina ceramic fiber products, including fiber, board, and other parts as you need.
6. Heating elements, including MoSi2 heating element and MoSi2 heating element.