Integrated Circuit Processing Laser Machine
China Integrated Circuit Processing Laser Machine, Find details about China Laser Machine, Laser Cutting Machine from Integrated Circuit Processing Laser Machine
Basic Info.
Model NO.
ZNLA1810V2
Engraving Method
Customization
Power
20W
Laser Wavelength
1064nm (Can Be Customized)
Frequency Range
20-80kHz
Beam Quality
<1.6
Etching Line Speed
<=7000mm / S
Minimum Line Width
50μm
Minimum Character
0.15mm
Repetition Accuracy
+-0.002mm
Power Supply
Single-Phase AC 200-260V/50Hz-60Hz
Overall Power Consumption
500W
Operating System
Winxp / Win7
Etching Range
Standard 200 * 200mm (Other Sizes Can Be Customize
Trademark
PEROVS
Transport Package
Wooden Box Shockproof
Specification
850*800*1650mm; 200Kg
Origin
Hangzhou
Model NO.
ZNLA1810V2
Engraving Method
Customization
Power
20W
Laser Wavelength
1064nm (Can Be Customized)
Frequency Range
20-80kHz
Beam Quality
<1.6
Etching Line Speed
<=7000mm / S
Minimum Line Width
50μm
Minimum Character
0.15mm
Repetition Accuracy
+-0.002mm
Power Supply
Single-Phase AC 200-260V/50Hz-60Hz
Overall Power Consumption
500W
Operating System
Winxp / Win7
Etching Range
Standard 200 * 200mm (Other Sizes Can Be Customize
Trademark
PEROVS
Transport Package
Wooden Box Shockproof
Specification
850*800*1650mm; 200Kg
Origin
Hangzhou
Product Desciption
Laser etching machine
Product Overview
ZNLA1810V2 series laser etching machine is a laser etching machine system developed by our company using the most advanced laser technology in the world today, specifically for the field of calcium titanite solar cells. With good output beam quality, high reliability and energy saving, it can be widely used for thin film etching of solar cells and can meet various demands of high precision and high efficiency research and processing. Adopting the world's leading level fiber laser and imported accessories, it operates with high precision, high speed, stable performance and a service life of up to 100,000 hours.
Product Features
(1) Flexible to customize the required etching area, flexible operation, etching area less than 200*200mm.
(2) small laser loss, strong stability, not affected by the outside world, stable laser beam output.
(3) full air-cooled laser, no consumables, low maintenance, high photoelectric conversion rate, low power consumption (≤ 800W), the bottom of the cost of use.
(4) with a super air knife, effective removal of substrate surface residue after etching.
(5) Software running on WINDOWS platform.
(6) CCD positioning and 4-axis (X, Y, Z, R) control system is installed, which can be operated by software to precisely position and adjust the position parameters.
(7) Equipped with dust suction and filtration device to collect and filter the residue, smoke and volatile gas generated in the etching.
(8) Equipped with vacuum adsorption platform, which can adsorb various sizes of substrates within 200*200mm.
Functional parameters
Model: ZNLA1810V2;
Power : 20W;
Laser wavelength: 1064nm (can be customized);
Frequency range: 20-80KHZ;
Beam quality: <1.6;
Etching line speed: ≤ 7000mm / s;
Minimum line width: 50μm;
Minimum character : 0.15mm;
Repetition accuracy : ±0.002mm;
Power supply : Single-phase AC 200-260V/50Hz-60Hz;
Overall power consumption: 500W;
Operating system: WinXP / Win7;
Cooling method: built-in air cooling;
Etching range: standard 200 * 200mm (other sizes can be customized);
Automatic stage XYR three-axis automatic stage, stage area 240*240mm, with mechanical positioning mechanism, X-axis travel 200mm, Y-axis travel 100mm, precision 0.01mm, R-axis 360°, fine-tuning 0.01°, while the laser light tool holder can be lifted, travel 500mm, precision 0.01mm. all four axes are controlled by software.
CCD objective lens 0.7X-5X continuous zoom, optical magnification 0.28X-2X continuous zoom, video magnification 14X-100X continuous zoom, high color VGA camera, VGA signal output
Special configuration Equipped with super air knife, blowing etching residue, and equipped with dust filtering device to clear the residue and but the smoke and gas generated in the process.
Equipment size Overall dimensions: about 850 * 800 * 1650mm (width * depth * height, based on the standard);
Lifting stroke: 500mm (software controlled lifting);
Workbench aluminum plate size: 240*240mm;
Weight of the whole machine: 200Kg.
Applications
Solar cell preparation, aerospace devices, electronic components, integrated circuit (IC) processing and other high precision fine fields.
Product Overview
ZNLA1810V2 series laser etching machine is a laser etching machine system developed by our company using the most advanced laser technology in the world today, specifically for the field of calcium titanite solar cells. With good output beam quality, high reliability and energy saving, it can be widely used for thin film etching of solar cells and can meet various demands of high precision and high efficiency research and processing. Adopting the world's leading level fiber laser and imported accessories, it operates with high precision, high speed, stable performance and a service life of up to 100,000 hours.
Product Features
(1) Flexible to customize the required etching area, flexible operation, etching area less than 200*200mm.
(2) small laser loss, strong stability, not affected by the outside world, stable laser beam output.
(3) full air-cooled laser, no consumables, low maintenance, high photoelectric conversion rate, low power consumption (≤ 800W), the bottom of the cost of use.
(4) with a super air knife, effective removal of substrate surface residue after etching.
(5) Software running on WINDOWS platform.
(6) CCD positioning and 4-axis (X, Y, Z, R) control system is installed, which can be operated by software to precisely position and adjust the position parameters.
(7) Equipped with dust suction and filtration device to collect and filter the residue, smoke and volatile gas generated in the etching.
(8) Equipped with vacuum adsorption platform, which can adsorb various sizes of substrates within 200*200mm.
Functional parameters
Model: ZNLA1810V2;
Power : 20W;
Laser wavelength: 1064nm (can be customized);
Frequency range: 20-80KHZ;
Beam quality: <1.6;
Etching line speed: ≤ 7000mm / s;
Minimum line width: 50μm;
Minimum character : 0.15mm;
Repetition accuracy : ±0.002mm;
Power supply : Single-phase AC 200-260V/50Hz-60Hz;
Overall power consumption: 500W;
Operating system: WinXP / Win7;
Cooling method: built-in air cooling;
Etching range: standard 200 * 200mm (other sizes can be customized);
Automatic stage XYR three-axis automatic stage, stage area 240*240mm, with mechanical positioning mechanism, X-axis travel 200mm, Y-axis travel 100mm, precision 0.01mm, R-axis 360°, fine-tuning 0.01°, while the laser light tool holder can be lifted, travel 500mm, precision 0.01mm. all four axes are controlled by software.
CCD objective lens 0.7X-5X continuous zoom, optical magnification 0.28X-2X continuous zoom, video magnification 14X-100X continuous zoom, high color VGA camera, VGA signal output
Special configuration Equipped with super air knife, blowing etching residue, and equipped with dust filtering device to clear the residue and but the smoke and gas generated in the process.
Equipment size Overall dimensions: about 850 * 800 * 1650mm (width * depth * height, based on the standard);
Lifting stroke: 500mm (software controlled lifting);
Workbench aluminum plate size: 240*240mm;
Weight of the whole machine: 200Kg.
Applications
Solar cell preparation, aerospace devices, electronic components, integrated circuit (IC) processing and other high precision fine fields.
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