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Thin Molybdenum Sheet Mo80cu20

China Thin Molybdenum Sheet Mo80cu20, Find details about China Molybdenum Mocu Sheet, Molybdenum Copper Sheet from Thin Molybdenum Sheet Mo80cu20

Model NO.
Mocu
Density
>9 g/cm3
Surface
Polished, Ground
Grade
Mola Mo1 Mocu
Trademark
Huapei
Transport Package
Standard Exported Plywood Case
Specification
0.05-100mm(thickness)*5-500mm(diameter)
Origin
China
HS Code
810296000
Model NO.
Mocu
Density
>9 g/cm3
Surface
Polished, Ground
Grade
Mola Mo1 Mocu
Trademark
Huapei
Transport Package
Standard Exported Plywood Case
Specification
0.05-100mm(thickness)*5-500mm(diameter)
Origin
China
HS Code
810296000

MoCu alloy sheet and molybdenum Mola sheet/wafer/disk
Molybdenum discs/wafer/washer/round circle
specification:
1) Grade: Mocu
2) Density: 9.8-10.2g/cm3
3) Size: 0.05-100mm(thickness)*5-500mm(diameter) or as your need
4) Flatness tolerance:<4um
5) Roughness:Ra1.6-Ra0.8
6) Surface: polished, ground.

Mola and pure molybdenum discs/wafer/washer/sheet
1. Purity: Mo>= 99.95%
2. Standard: GB/T 4182 or ASTM

3. Property specification
 1) high melting point, high strength,
 2) smooth and clean surface,
 3) good conductions, small linear expansion coefficient and good heat-resistance

4. Chemical composition

Content of molybdenumContent of all other elementsContent of each element
≥99.95%≤0.05%≤0.01%

5. Molybdenum sheet dimension:
Thin molybdenum sheet size and tolerance as follows:
Thickness mmTolerance of thicknessWidthTolerance of WidthLength Tolerance of Length
First GlassTwo glass
0.10~0.15±0.01±0.0250~200±2100~1200±5
>0.15~0.30±0.02±0.0350~200±2100~1200±5
>0.30~0.50±0.03±0.0450~200±2100~1200±5
>0.50~0.70±0.04±0.0550~200±3100~1200±5
>0.70~1.0±0.05±0.0850~200±3100~1200±5
>1.0~2.0±0.06±0.1050~200±5100~1200±5
>2.0~3.0±0.08±0.1550~200±5100~1200±5
>3.0~4.0±0.10±0.2050~200±5100~1200±5
>4.0~5.0±0.12±0.3050~200±5100~1200±5

6. Application of Molybdenum wafer/discs
Molybdenum wafer/discs are widely used as contact materials in silicon controlled rectifier diodes, transistors and thyristors mounting material for power semiconductor devices and heat sink bases.

7. Delivery time: 7-20days according to your required qty.

8. Shipment Methods:
By express, by Sea or Air transportation

9. Standard and safe Packing
1)paper wrapped the sheets, then plastic paper protected from moisture
2)Foam board around the the inner wooden case
3)Standard exported plywood case outside

10. The advantage of us:
 1) leading producer, more than 15 years producing experience
 2) low price in the market,factory direct sales.
 3) the whole production line from powder to finished products, top and steady quality assured
 4) fast delivery and best after-sale service


 
 

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