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OEM/ODM 4 Layer Electronic PCB Board From Shenzhen Manufacturer

China OEM/ODM 4 Layer Electronic PCB Board From Shenzhen Manufacturer, Find details about China PCB, Multilayer PCB from OEM/ODM 4 Layer Electronic PCB Board From Shenzhen Manufacturer

Model NO.
UCAA-20160324-6
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Finish
Immersion/ Chemical Gold 3u′′
Overall Board Thickness
1.6mm
Brand of White Oil
Taiyo Psr 4000-Lew3
Lead Time
7 Working Days
Trademark
Ucreate PCB
Transport Package
Vacuum Package
Specification
UL, RoHS, SGS, ISO9001
Origin
China
HS Code
8534009000
Model NO.
UCAA-20160324-6
Production Process
Subtractive Process
Base Material
Copper
Insulation Materials
Epoxy Resin
Surface Finish
Immersion/ Chemical Gold 3u′′
Overall Board Thickness
1.6mm
Brand of White Oil
Taiyo Psr 4000-Lew3
Lead Time
7 Working Days
Trademark
Ucreate PCB
Transport Package
Vacuum Package
Specification
UL, RoHS, SGS, ISO9001
Origin
China
HS Code
8534009000

                       Ucreate LTD PCB's aim
 
             Customer Satisfaction is Always Our First Priority!
 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
 

Our main products range from Multilayer PCB,High frequency PCB, Metal base PCB, Hi-Tg heavy copper foil PCB and Mixed Dielectric base PCB, HDI, rigid-flex PCB,and many other customized PCB with special performance which are widely used in Communication, power supply, computer, consumer electronics, industrial control, medical device, Aeronautics and Astronautics high technology field and spread over  America, Europe and some Asia Districts, achieving their satisfication.



1.Products Application
OEM/ODM 4 Layer Electronic PCB Board From Shenzhen Manufacturer


2.Technical Capabilities
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control		±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness		 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist
 		0.75% 

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