IXPE Black Conductive Sponge
China IXPE Black Conductive Sponge, Find details about China IXPE Black Conductive Sponge, Lack Conductive Sponge from IXPE Black Conductive Sponge
Basic Info.
Model NO.
JH3070
Functional Layer
IXPE
Packaging
PE
Bag Sealing Methods
Customized
Trademark
HAOUGER
Transport Package
Carton
Specification
customized
Origin
China
HS Code
3920109090
Model NO.
JH3070
Functional Layer
IXPE
Packaging
PE
Bag Sealing Methods
Customized
Trademark
HAOUGER
Transport Package
Carton
Specification
customized
Origin
China
HS Code
3920109090
Product Desciption
Product Description:
The product is a closed-cell soft sponge, which is formed by adding conductive fillers into the sponge through radiation crosslinking and foaming. After sheet molding, conductive fillers form conductive paths/networks inside the sheet, so as to achieve the purpose of electrostatic leakage
High, medium and low density products;
The surface resistivity is 104~106Ω and the volume resistivity is 104~106Ω/cm;
Clean, dust-free and detritus-free: The consolidation ability of the conductive fillers was greatly improved after the crosslinking of the molecular chains.
Corrosion-free and corrosion-resistant: No peculiar smell, and resistant to organic solvents and chemical reagents;
Weatherproof and moisture-proof, anti-seismic and heat-insulating: Closed-hole bubbles are fine and even, with good hygroscopic performance, cushioning and anti-seismic, heat and sound insulation;
Machining performance is good, can be punched into various shapes required by customers.
Purpose of the product:
The products are mainly used for anti-static packaging of anti-static plugging board, buffer pad, semiconductor chip, printed circuit board, integrated circuit, precision high-frequency electronic products, storage and transportation packaging of industrial modules, high-frequency components, aeronautical instruments, weapons and ammunition.
The product is a closed-cell soft sponge, which is formed by adding conductive fillers into the sponge through radiation crosslinking and foaming. After sheet molding, conductive fillers form conductive paths/networks inside the sheet, so as to achieve the purpose of electrostatic leakage
High, medium and low density products;
The surface resistivity is 104~106Ω and the volume resistivity is 104~106Ω/cm;
Clean, dust-free and detritus-free: The consolidation ability of the conductive fillers was greatly improved after the crosslinking of the molecular chains.
Corrosion-free and corrosion-resistant: No peculiar smell, and resistant to organic solvents and chemical reagents;
Weatherproof and moisture-proof, anti-seismic and heat-insulating: Closed-hole bubbles are fine and even, with good hygroscopic performance, cushioning and anti-seismic, heat and sound insulation;
Machining performance is good, can be punched into various shapes required by customers.
Purpose of the product:
The products are mainly used for anti-static packaging of anti-static plugging board, buffer pad, semiconductor chip, printed circuit board, integrated circuit, precision high-frequency electronic products, storage and transportation packaging of industrial modules, high-frequency components, aeronautical instruments, weapons and ammunition.
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