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Panasonic SMT Chip Mounter Npm-D3 Placement Machine

China Panasonic SMT Chip Mounter Npm-D3 Placement Machine, Find details about China SMT, Chip Mounter from Panasonic SMT Chip Mounter Npm-D3 Placement Machine

Model NO.
NPM-D3
Type
High-speed Chip Mounter
Model No.
Npm-D3
Model
High-Speed Chip Mounter
Product Name
Panasonic Pick and Place Machine
Placement Speed
63, 300 Cph
Usage
SMT, SMD, LED, PCB, PCBA
Concept
Dual-Gantry, Multi-Head, Process-Driven Module
Applicable Heads
16, 12, 8, 2
Board Dimensions (Single Lane)
L 510mm X W 590mm
Component Height
28mm
Electric
2.7kVA
Max. Component
100mm X 90mm
Trademark
Panasonic
Transport Package
Mood Package
Specification
90cm*270cm*150cm
Origin
Japan
HS Code
8515190000
Model NO.
NPM-D3
Type
High-speed Chip Mounter
Model No.
Npm-D3
Model
High-Speed Chip Mounter
Product Name
Panasonic Pick and Place Machine
Placement Speed
63, 300 Cph
Usage
SMT, SMD, LED, PCB, PCBA
Concept
Dual-Gantry, Multi-Head, Process-Driven Module
Applicable Heads
16, 12, 8, 2
Board Dimensions (Single Lane)
L 510mm X W 590mm
Component Height
28mm
Electric
2.7kVA
Max. Component
100mm X 90mm
Trademark
Panasonic
Transport Package
Mood Package
Specification
90cm*270cm*150cm
Origin
Japan
HS Code
8515190000

Panasonic SMT Chip Mounter Npm-D3 Placement Machine
Panasonic SMT Chip Mounter Npm-D3 Placement Machine
Panasonic SMT Chip Mounter Npm-D3 Placement Machine
Panasonic SMT Chip Mounter Npm-D3 Placement Machine
Panasonic SMT Chip Mounter Npm-D3 Placement Machine
Model IDNPM-D3
Rear head
Front head		Lightweight 16-nozzle head12-nozzle head8-nozzle head2-nozzle headDispensing headNo head
Lightweight 16-nozzle headNM-EJM6DNM-EJM6D-MDNM-EJM6D
12-nozzle head
8-nozzle head
2-nozzle head
Dispensing headNM-EJM6D-MD NM-EJM6D-D
Inspection headNM-EJM6D-MANM-EJM6D-A
No headNM-EJM6DNM-EJM6D-D 
 
PCB dimensions*1 (mm)Dual-lane modeL 50 x W 50 ~ L 510 x W 300
Single-lane modeL 50 x W 50 ~ L 510 x W 590
PCB exchange timeDual-lane mode0 s* *No 0s when cycle time is 3.6 s or less
Single-lane mode3.6 s* *When selecting short conveyors
Electric source3-phase AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Pneumatic source *20.5 MPa, 100 L /min (A.N.R.)
Dimensions *2 (mm)W 832 x D 2 652 *3 x H 1 444 *4
Mass1 680 kg (Only for main body:This differs depending on the option configuration.)
 
Placement headLightweight 16-nozzle head
(Per head)		12-nozzle head
(Per head)		8-nozzle head
(Per head)		2-nozzle head (Per head)
High Production mode [ON]High production mode [OFF]
Max. speed42 000 cph
(0.086 s/ chip)		38 000 cph
(0.095 s/ chip)		34 500 cph
(0.104 s/ chip)		21 500 cph
(0.167 s/ chip)		5 500 cph (0.655 s/ chip)
4 250 cph(0.847 s/ QFP)
Placement ccuracy(Cpk1)± 40 µm/chip±30 μm / chip
(±25 μm / chip*5)		±30 μm / chip± 30 µm/chip
± 30 µm/QFP 
12mm to 32mm
± 50 µm/QFP
12mm Under
 		± 30 µm/QFP
Component dimensions(mm)0402 chip*6 to L 6 x W 6 x T 303015*6*7/0402 chip*6 to L 6 x W 6 x T 30402 chip*6 to L 12 x W 12 x T 6.50402 chip*6 to L 32 x W 32 x T 120603 chip to L 100 x W 90 x T 28
Component
supply		TapingTape : 4 / 8 / 12 / 16 / 24 / 32 / 44 / 56 mmTape : 4 to 56 / 72 / 88 / 104 mm
TapingMax. 68 (4, 8 mm tape, Small reel)
Stick Max.16 (Single stick feeder)
Tray Max.20 (per tray feeder)
 
Dispensing headDot dispensingDraw dispensing
Dispensing speed0.16 s/dot (Condition : XY=10 mm, Z=less than 4 mm movement, No θ rotation)4.25 s/component (Condition: 30 mm x 30 mm corner dispensing)*8
Adhesive position accuracy
(Cpk1)		± 75 μ m /dot± 100 μ m /component
Applicable components1608 chip to SOP,PLCC,QFP, Connector, BGA, CSPSOP,PLCC,QFP, Connector, BGA, CSP
 
Inspection head2D inspection head (A)2D inspection head (B)
Resolution18 µm9 µm
View size (mm)44.4 x 37.221.1 x 17.6
Inspection processing timeSolder Inspection *90.35s/ View size
Component Inspection *90.5s/ View size
Inspection
object		Solder Inspection *9Chip component : 100 μm x 150 μm or more (0603 mm or more)
Package component : φ150 μm or more		Chip component : 80 μm x 120 μm or more (0402 mm or more)
Package component : φ120 μm or more
Component Inspection *9Square chip (0603 mm or more), SOP, QFP (a pitch of 0.4 mm or more), CSP, BGA, Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10Square chip (0402 mm or more), SOP, QFP (a pitch of 0.3 mm or more), CSP, BGA,Aluminum electrolysis capacitor, Volume, Trimmer, Coil, Connector*10
Inspection
items		Solder Inspection *9Oozing, blur, misalignment, abnormal shape, bridging
Component Inspection *9Missing, shift, flipping, polarity, foreign object inspection *11
Inspection position accuracy *12 ( Cpk1)± 20 μm± 10 μm
No. of
inspection		Solder Inspection *9Max. 30 000 pcs./machine (No. of components : Max. 10 000 pcs./machine)
Component Inspection *9Max. 10 000 pcs./machine
 

*1 :

Due to a difference in PCB transfer reference, a direct connection with NPM (NM-EJM9B) / NPM-W (NM-EJM2D) /NPM-W2 (NM-EJM7D) dual lane specs cannot be established.
*2 :Only for main body
*3 :Dimension D including tray feeder : 2 683 mm
Dimension D including feeder cart : 2 728 mm
*4 :Excluding the monitor, signal tower and ceiling fan cover.
*5 :±25 μm placement support option.(Under conditions specified by Panasonic)
*6 :The 03015/0402 mm chip requires a specific nozzle/feeder.
*7 :Support for 03015 mm chip placement is optional.(Under conditions specified by Panasonic:Placement accuracy ±30 μm / chip )
*8 :A PCB height measurement time of 0.5s is included.
*9 :One head cannot handle solder inspection and component inspection at the same time.
*10 :Please refer to the specification booklet for details.
*11 :Foreign object is available to chip components. (Excluding 03015 mm chip)
*12 :This is the solder inspection position accuracy measured by our reference using our glass PCB for plane calibration. It may be affected by sudden change of ambient temperature.

*Placement tact time, inspection time and accuracy values may differ slightly depending on conditions
*Please refer to the specification booklet for details.



 
 

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