Motherboard Design PCBA Board Mass Production
China Motherboard Design PCBA Board Mass Production, Find details about China PCB, Motherboard from Motherboard Design PCBA Board Mass Production
Basic Info.
Model NO.
PCBA
Condition
Used
Material
Shengyi Fr4
Mini Hole
0.25mm
Mini Width/Space
5/5mil
Solder Mask
Green
Silkscreen
White
Copper
1/0.5oz
Finish
HASL Lead Free
Trademark
NO
Transport Package
Anti-Electrostatic Packaging
Specification
182 x 88mm
Origin
Made in China
HS Code
8534001000
Model NO.
PCBA
Condition
Used
Material
Shengyi Fr4
Mini Hole
0.25mm
Mini Width/Space
5/5mil
Solder Mask
Green
Silkscreen
White
Copper
1/0.5oz
Finish
HASL Lead Free
Trademark
NO
Transport Package
Anti-Electrostatic Packaging
Specification
182 x 88mm
Origin
Made in China
HS Code
8534001000
Product Desciption
Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.
Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%
Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%
| Rigid PCB Production Capacity | ||
| SERIAL | ITEM | TECHNICAL DATA |
| 1 | Types of Products | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI |
| 2 | Layers | 2-32(layers) |
| 3 | Max Board Size | 450x660mm 18" x 26" |
| 4 | Min Board Thickness | 4(layers)0.40mm 16mil |
| 6(layers)0.80mm 32mil | ||
| 8(layers)1.00mm 40mil | ||
| 10(layers)1.20mm 48mil | ||
| 5 | Copper Clad(Max.) | 20 oz(outer)/4 oz(inner) |
| 6 | Min line Width/space | 0.075mm 3mil |
| 7 | Drill Size Mechanical (min) | 0.20mm 8mil |
| 8 | Drill Size Laser(min) | 0.10mm 4mil |
| 9 | PTH Wall Thickness | 0.020mm 0.8mil |
| 10 | PTH dia tolerance | ±0.075mm ±3mil |
| 11 | NPTH hole dia tolerance | ±0.05mm ±2mil |
| 12 | Hole Position Deviation | ±0.05mm ±2mil |
| 13 | Outline Tolerance | ±0.10mm ±4mil |
| 14 | S/M Pitch | 0.08mm 3mil |
| 15 | Insulation Resistance | 1E+12Ω(Normal) |
| 16 | Test Voltage | 50~300V |
| 17 | Aspect ratio | 8:01 |
| 18 | Thermal Shock | 3x10Sec@288 ºC |
| 19 | Warp and Twist | ≤0.7% |
| 20 | Current breakdown | 10A |
| 21 | Electric Strength | >1.3KV/mm |
| 22 | Peel Strength | 1.4N/mm |
| 23 | Solder Mask Abrasion | ≥6H |
| 24 | Flammability | 94V-0 |
| 25 | Impedance Control | +/-10%(Differential) |
| 26 | Buried Via | Yes |
| 27 | Blind Via | Yes |
| 28 | HDI | 2+N+2 4mil Via hole |
| 29 | Surface Finished | ENIG, ImAg, ImSn, OSP, HASL free |
| 30 | Materials | FR-4 , Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, black Fr4 |
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