UL cUL PCBA Board Leiterplatte Production with 0 Profit
China UL cUL PCBA Board Leiterplatte Production with 0 Profit, Find details about China PCB, Printed Circuit Board from UL cUL PCBA Board Leiterplatte Production with 0 Profit
Basic Info.
Model NO.
pcb
Base Material
Fr4 Tg140
Insulation Materials
Epoxy Resin
Model
FR-4
Brand
OEM
Board Thickness
1.6mm
Solder Mask
Green
Silkscreen
White
Mini Hole
0.3mm
Mini Width/Space
5/5mil
Finish
Immersion Gold 2u"
Trademark
coenrichpcb
Transport Package
Vacuum
Specification
120 mm x 80 mm
Origin
Made in China
HS Code
8534009000
Model NO.
pcb
Base Material
Fr4 Tg140
Insulation Materials
Epoxy Resin
Model
FR-4
Brand
OEM
Board Thickness
1.6mm
Solder Mask
Green
Silkscreen
White
Mini Hole
0.3mm
Mini Width/Space
5/5mil
Finish
Immersion Gold 2u"
Trademark
coenrichpcb
Transport Package
Vacuum
Specification
120 mm x 80 mm
Origin
Made in China
HS Code
8534009000
Product Desciption
Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.
Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%
Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%
| Rigid PCB Production Capacity | ||
| SERIAL | ITEM | TECHNICAL DATA |
| 1 | Types of Products | HDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI |
| 2 | Layers | 2-32(layers) |
| 3 | Max Board Size | 450x660mm 18" x 26" |
| 4 | Min Board Thickness | 4(layers)0.40mm 16mil |
| 6(layers)0.80mm 32mil | ||
| 8(layers)1.00mm 40mil | ||
| 10(layers)1.20mm 48mil | ||
| 5 | Copper Clad(Max.) | 20 oz(outer)/4 oz(inner) |
| 6 | Min line Width/space | 0.075mm 3mil |
| 7 | Drill Size Mechanical (min) | 0.20mm 8mil |
| 8 | Drill Size Laser(min) | 0.10mm 4mil |
| 9 | PTH Wall Thickness | 0.020mm 0.8mil |
| 10 | PTH dia tolerance | ±0.075mm ±3mil |
| 11 | NPTH hole dia tolerance | ±0.05mm ±2mil |
| 12 | Hole Position Deviation | ±0.05mm ±2mil |
| 13 | Outline Tolerance | ±0.10mm ±4mil |
| 14 | S/M Pitch | 0.08mm 3mil |
| 15 | Insulation Resistance | 1E+12Ω(Normal) |
| 16 | Test Voltage | 50~300V |
| 17 | Aspect ratio | 8:01 |
| 18 | Thermal Shock | 3x10Sec@288 ºC |
| 19 | Warp and Twist | ≤0.7% |
| 20 | Current breakdown | 10A |
| 21 | Electric Strength | >1.3KV/mm |
| 22 | Peel Strength | 1.4N/mm |
| 23 | Solder Mask Abrasion | ≥6H |
| 24 | Flammability | 94V-0 |
| 25 | Impedance Control | +/-10%(Differential) |
| 26 | Buried Via | Yes |
| 27 | Blind Via | Yes |
| 28 | HDI | 2+N+2 4mil Via hole |
| 29 | Surface Finished | ENIG, ImAg, ImSn, OSP, HASL free |
| 30 | Materials | FR-4 , Copper core, Getek , Rogers, Aluminum core, High TG, Teflon, black Fr4 |
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