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Laptop Cooling Silicone Heat Sink Gap Filler Thermal Pad

China Laptop Cooling Silicone Heat Sink Gap Filler Thermal Pad, Find details about China Thermal Pad, Cooling Pad from Laptop Cooling Silicone Heat Sink Gap Filler Thermal Pad

Model NO.
TS100
Material
Organic Silicone
Application
Industrial, LED Light/CPU
Certification
ISO, REACH, RoHS, SDS
Model
Ts100
Material of Items
Silicone and etc
Appearance
Grey
Thickness
0.5mm or Custom
Size
Customized
Specific Gravity
2.4G/Cc
Hardness
35 Shore 00
Thermal Conductive
1.0W/M.K
Volume Resistivity
9.6X10^12
Shape
Customized
Origin of Item
China
Applying
Laptop CPU/LED/PCB/LCD/Mobile
Trademark
Tensan/No mark/OEM
Transport Package
Normal Packing
Specification
0.5--8mm thickness
Origin
Shenzhen, China
HS Code
3920999090

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