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PCB Electronic Fabrication De Circuit Imprimé Pour Particulier

China PCB Electronic Fabrication De Circuit Imprimé Pour Particulier, Find details about China Printed Circuit Board, Circuit Board Prototype from PCB Electronic Fabrication De Circuit Imprimé Pour Particulier

Model NO.
K0988
Production Process
Semi-Additive Process
Base Material
Fr4
Insulation Materials
Organic Resin
Brand
Fastline
Board Material
Fr4
Layers
1 to 30 Layers
Board Thickness
1.6mm
Copper Thickness
1oz
Solder Mask
Green
Silk Screen
White
Surface Treatment
HASL Lead Free
Test
100%
Lead Time
6-8 Working Days
Min. Line Width
0.075mm
Trademark
Fastline
Transport Package
Vacuum Packing
Specification
IP class -2
Origin
Shenzhen, China
HS Code
853400900
Model NO.
K0988
Production Process
Semi-Additive Process
Base Material
Fr4
Insulation Materials
Organic Resin
Brand
Fastline
Board Material
Fr4
Layers
1 to 30 Layers
Board Thickness
1.6mm
Copper Thickness
1oz
Solder Mask
Green
Silk Screen
White
Surface Treatment
HASL Lead Free
Test
100%
Lead Time
6-8 Working Days
Min. Line Width
0.075mm
Trademark
Fastline
Transport Package
Vacuum Packing
Specification
IP class -2
Origin
Shenzhen, China
HS Code
853400900
Pcb Electronic fabrication de circuit imprimé pour particulier



Product Description

                                                 Fastline  PCB's aim
 
                   Customer Satisfaction is Always Our First Priority!

 
 *Quality Policy 

           *Top Quality and high efficiency

                     *Improve continuously

                             *Achieve customer's satisfaction
PCB Electronic Fabrication De Circuit Imprimé Pour Particulier


*Layers: 1-22
*Base material: FR-4 CEM-1
*Thickness: 0.2-5.0mm
*Solder mask: Green, black, red, yellow, white
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold, OSP. Lead free HASL.
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)
We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.
Single-double sides pcb delivery time: 12-24 hours
4 layer- 8 layer pcb delivery time: 48-96 hours

Technical Capabilities
 
ItemsSpeci.Remark
Max panel size32" x 20.5"(800mm x 520mm) 
Min trace width/ space (inner layer)4mil/4mil(0.1mm/0.1mm) 
Min PAD (inner layer)5 mil(0.13mm)hole ring width
Min thickness(inner layer)4 mil(0.1mm)without copper
Inner copper thickness1~4 oz 
Outer copper thickness0.5~6 oz 
Finished board thickness0.4-3.2 mm 

Board thickness tolerance control		±0.10 mm±0.10 mm1~4 L
±10%±10%6~8 L
±10%±10%≥10 L
Inner layer treatmentbrown oxidation 
Layer count Capability1-30 LAYER 
alignment between ML±2mil 
Min drilling0.15 mm 
Min finished hole0.1 mm 
Hole precision±2 mil(±50 um) 
tolerance for Slot±3 mil(±75 um) 
tolerance for PTH±3 mil(±75um) 
tolerance for NPTH±2mil(±50um) 
Max Aspect Ratio for PTH8:1 
Hole wall copper thickness15-50um 
Alignment of outer layers4mil/4mil 
Min trace width/space for outer layer4mil/4mil 
Tolerance of Etching+/-10% 
Thickness of solder maskon trace0.4-1.2mil(10-30um) 
at trace corner≥0.2mil(5um) 
On base material≤+1.2mil
  Finished thickness		 
Hardness of solder mask6H 
Alignment of solder mask film±2mil(+/-50um) 
Min width of solder mask bridge4mil(100um) 
Max hole with solder plug0.5mm 
Surface finishHAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. 
Max Nickel thickness for Gold finger280u"(7um) 
Max gold thickness for Gold finger30u"(0.75um) 
Nickel thickness in Immersion Gold120u"/240u"(3um/6um) 
Gold thickness in Immersion Gold2u"/6u"(0.05um/0.15um) 
Impedance control and its tolerance50±10%,75±10%,100±10% 110±10% 
Trace Anti-stripped strength≥61B/in(≥107g/mm) 
bow and twist
 		0.75% 

Products Equipment

PCB Electronic Fabrication De Circuit Imprimé Pour Particulier
How to contact us


Cellphone/  :+8618028778060

Cassie Qiu
 


 


 

 

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