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Economical and Practical Well Made High Efficiency Die Bonding Machine for Semiconductor

China Economical and Practical Well Made High Efficiency Die Bonding Machine for Semiconductor, Find details about China Motherboard, CCM Camera Module from Economical and Practical Well Made High Efficiency Die Bonding Machine for Semiconductor

Model NO.
Dwin- Wafer carrying -03A
Precision
High Precision
Condition
New
Certification
ISO
Warranty
6 Months
Automatic Grade
Automatic
Installation
Vertical
Driven Type
Electric
Trademark
D-win
Specification
2700x 1400 x 1970 mm
Origin
China

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