China LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Wire Bonder/Ultrasonic Manual Wire Bonding Machine, Find details about China Wire Bonding Machine, Ball Bonding Machine from LED/Chips/Diode Laser Tube/Inner Lead/Semiconductor Devices Laboratory Uses Wire Bonder/Ultrasonic Manual Wire Bonding Machine
Application:
LED, IC chips, diode, laser tube, the inner lead, semiconductor devices etc.
Specification:
1,electric requiement:220VAC±10%,50HZ,be sure connected to ground
2,wire diameter:17~50μm
3,ultrasonic power:0-3W, two channel. can be set separately of the two point 4,bond time:0-200ms,two channel
5,bond force:35-180g,two channel
6,digital camera systerm:optional
7,min bonding time:0.4s/wire
8,span between first bond to second bond by automatic mode: more than 4mm. 9,length of terminal wire: 0-2mm
10,ball dimension:2-4 times bigger setable
11,bond temperature: house temperature ~ 400°C
12,jig moving area: Φ25mm
13,microscope:15X,30X
14,dimension:700*460*550mm
15,weight:28kg
guangzhou minder-hightech co.,ltd
contact:shunyu.hu