China Ultrasonic Wire Bonding Machine Capillary Wire Bond Wire Bonding Machine, Find details about China Heavy Wire Bonder, Heavy Wire Bonding Machine from Ultrasonic Wire Bonding Machine Capillary Wire Bond Wire Bonding Machine
Application:
High power dynatron/FET/SCR, Power module, IGBT, High power Fast recovery diode, Schottky transistor, Lead attachment,auto sensors, wire bonding, TO-3,TO-3P,TO-3PF,TO-3PN,TO-3PL,TO-220F,TO-126, TO-12F,TO-66,TO-251,TO-202 etc.
Specification:
1,electric requiement:220VAC±10%,50HZ,be sure connected to ground 2,aluminium wire diameter:75~500μm (3~20mil)
3,ultrasonic power:0-30W, two channel.can be set separately of the two point 4,bond time:10-500ms,two channel
5,bond force:30-1200g,two channel
6,motorized Y:0-18mm
7,microscope rate:7.5 and 15
8,working area:Φ25mm
9,light:adjustable brightness
10,size:620×610×560mm
11,weight:~40kg
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guangzhou minder-hightech co.,ltd
contact:shunyu.hu