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HTC Metal Bond Diamond Tools Grinding Segments

China HTC Metal Bond Diamond Tools Grinding Segments, Find details about China Lavina Diamond Tools, Diamond Tools for Concrete Floor from HTC Metal Bond Diamond Tools Grinding Segments

Trademark
PILIHU
Specification
3 segments
Origin
Hangzhou China
Trademark
PILIHU
Specification
3 segments
Origin
Hangzhou China

2 segments HTC Diamond Concrete Grinding Disk Polishing Tooling
 

Material:   Metal bond +diamond segments
Segment Type:Double Round/Single Bar
Grit:6#, 16/18#, 20/25#, 30/40#, 50/60#, 70/80#, 80/100#,120/150#, 200/220# 325/400# 
Applications:suitable for concrete and floor surface preparation, durable metal and diamond compound, quick removal of materials with high efficiency and long lifespan
Advantage:high density diamond and extra height segments provide high grinding and extreme removal capacity on concrete floors.
Note:special logo, segment sizes and shapes, installation are available by customer's request.
 
HTC Metal Bond Diamond Tools Grinding SegmentsHTC Metal Bond Diamond Tools Grinding SegmentsHTC Metal Bond Diamond Tools Grinding SegmentsHTC Metal Bond Diamond Tools Grinding SegmentsHTC Metal Bond Diamond Tools Grinding Segments

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