Diamond Grinding Wheels with Resin Bonder
1.Ceramic bond diamond grinding wheelAppliable material: Semiconductor wafers and solar wafers, PCD (drill bits),CVD,PCBN,tungsten carbide,engineering structural ceramics,gem,crystal,magnetic material and other hard and brittle material.
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2.Resin bond diamond grinding wheelAppliable material :Non metallic materials,tungsten carbide, ceramic, agate, optical glass, semiconductor materials,cast iron,stone and so on.
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3.Metal bond diamond grinding wheelAppliable material:Glass,ceramic,silicon wafer,floor slab,marble,granite,concrete,semiconductor materials and super hard materials.
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4.FeaturesGood for non metallic materials.
High efficiency and low consumption.
High accuracy.
Good thermal conductivity.
Good self-sharpening.
Less heat in grinding, fewer burned workpiece.
Predictable quality and shape for the workpiece.
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