China Copper Low Resistance Heating Alloy Wire, Find details about China Low Resistance Alloy Wire, Copper Nickel Alloy Wire from Copper Low Resistance Heating Alloy Wire
Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy | |||||||
Properties\Grade | CuNi1 | CuNi2 | CuNi6 | CuNi8 | CuMn3 | CuNi10 | |
Main Chemical Composition | Ni | 1 | 2 | 6 | 8 | _ | 10 |
Mn | _ | _ | _ | _ | 3 | _ | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(oC) | 200 | 200 | 200 | 250 | 200 | 250 | |
Resisivity at 20oC (Ω mm2/m) | 0.03 | 0.05 | 0.1 | 0.12 | 0.12 | 0.15 | |
Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.8 | 8.9 | |
Thermal Conductivity(α × 10-6/oC) | < 100 | < 120 | < 60 | < 57 | < 38 | < 50 | |
Tensile Strength(Mpa) | ≥ 210 | ≥ 220 | ≥ 250 | ≥ 270 | ≥ 290 | ≥ 290 | |
EMF vs Cu(μ V/oC)(0~100oC) | -8 | -12 | -12 | -22 | _ | -25 | |
Approximate Melting Point( oC) | 1085 | 1090 | 1095 | 1097 | 1050 | 1100 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non | |
Properties\Grade | CuNi14 | CuNi19 | CuNi23 | CuNi30 | CuNi34 | CuNi44 | |
Main Chemical Composition | Ni | 14 | 19 | 23 | 30 | 34 | 44 |
Mn | 0.3 | 0.5 | 0.5 | 1 | 1 | 1 | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(oC) | 300 | 300 | 300 | 350 | 350 | 400 | |
Resisivity at 20oC (Ω mm2/m) | 0.2 | 0.25 | 0.3 | 0.35 | 0.4 | 0.49 | |
Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
Thermal Conductivity(α × 10-6/oC) | < 30 | < 25 | < 16 | < 10 | < 0 | < -6 | |
Tensile Strength(Mpa) | ≥ 310 | ≥ 340 | ≥ 350 | ≥ 400 | ≥ 400 | ≥ 420 | |
EMF vs Cu(μ V/oC)(0~100oC) | -28 | -32 | -34 | -37 | -39 | -43 | |
Approximate Melting Point( oC) | 1115 | 1135 | 1150 | 1170 | 1180 | 1280 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non | |