China High Quality Copper Nickel Alloy Wire for Electronic Component, Find details about China Copper Nickel Alloy Wire, Copper Nickel Resistance Wire from High Quality Copper Nickel Alloy Wire for Electronic Component
Chemical Composition and Main Property of Cu-Ni Low Resistance Alloy | |||||||
Properties\Grade | CuNi1 | CuNi2 | CuNi6 | CuNi8 | CuMn3 | CuNi10 | |
Main Chemical Composition | Ni | 1 | 2 | 6 | 8 | _ | 10 |
Mn | _ | _ | _ | _ | 3 | _ | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(oC) | 200 | 200 | 200 | 250 | 200 | 250 | |
Resisivity at 20oC (Ω mm2/m) | 0.03 | 0.05 | 0.1 | 0.12 | 0.12 | 0.15 | |
Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.8 | 8.9 | |
Thermal Conductivity(α × 10-6/oC) | < 100 | < 120 | < 60 | < 57 | < 38 | < 50 | |
Tensile Strength(Mpa) | ≥ 210 | ≥ 220 | ≥ 250 | ≥ 270 | ≥ 290 | ≥ 290 | |
EMF vs Cu(μ V/oC)(0~100oC) | -8 | -12 | -12 | -22 | _ | -25 | |
Approximate Melting Point( oC) | 1085 | 1090 | 1095 | 1097 | 1050 | 1100 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non | |
Properties\Grade | CuNi14 | CuNi19 | CuNi23 | CuNi30 | CuNi34 | CuNi44 | |
Main Chemical Composition | Ni | 14 | 19 | 23 | 30 | 34 | 44 |
Mn | 0.3 | 0.5 | 0.5 | 1 | 1 | 1 | |
Cu | Bal | Bal | Bal | Bal | Bal | Bal | |
Max Continuous Service Temperature(oC) | 300 | 300 | 300 | 350 | 350 | 400 | |
Resisivity at 20oC (Ω mm2/m) | 0.2 | 0.25 | 0.3 | 0.35 | 0.4 | 0.49 | |
Density(g/cm3) | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | 8.9 | |
Thermal Conductivity(α × 10-6/oC) | < 30 | < 25 | < 16 | < 10 | < 0 | < -6 | |
Tensile Strength(Mpa) | ≥ 310 | ≥ 340 | ≥ 350 | ≥ 400 | ≥ 400 | ≥ 420 | |
EMF vs Cu(μ V/oC)(0~100oC) | -28 | -32 | -34 | -37 | -39 | -43 | |
Approximate Melting Point( oC) | 1115 | 1135 | 1150 | 1170 | 1180 | 1280 | |
Micrographic Structure | austenite | austenite | austenite | austenite | austenite | austenite | |
Magnetic Property | non | non | non | non | non | non | |