China High Conductive Ink Printer Silver Conductive Ink Conductive Paste, Find details about China Silver Paste, Paste from High Conductive Ink Printer Silver Conductive Ink Conductive Paste
Quantity(Kilograms) | 1 - 1 | >1 |
Est. Time(days) | 7 | To be negotiated |
SNM silicone shingled solar module conductive adhesive is an adhesive used in photovoltaic shingled modules. It overlaps and bonds the cut photovoltaic cells to each other and forms a conductive circuits, which has excellent weather resistance and rework performance. It is non-toxic up to European RoHS environmental regulation
Excellent weather resistance
Excellent rework performance
Fast curing speed
1) Remove the conductive adhesive from the low temperature environment and thaw at room temperature for 1h-1.5h before use.
2) Select the appropriate model and pressure (0.4Mpa) for dispensing or printing.
3) Curing at temperatures above 170ºC for 20 seconds to ensure bonding performance.
4) After the sizing is completed, the solar cell can be tested after being cooled at room temperature. The bonding performance will be better after 2 hours.
5) The remaining product after use can continue to be stored in a low temperature environment without affecting its performance
Technical Spec:
Test | Properties |
Viscosity (Pa.S) (NDJ-99, 4#, 10rpm, 25±1ºC) | 5-30 |
Solid Content (%) | 60±2 |
Screen Mesh (Stainless steel screen) | 165~325 |
Screen Mesh (Polyester screen) | 160~300 |
Recommended Drying T/t | 130ºC/30min, or 150ºC/10min |
Coverage(cm 2 /g) (dependent on film thickness) | 100-200 |
Sheet Resistance(Ω/sq) (film thickness: 6µm) | <0.07 |
Adhesion/ Tape Pull (3M Scotch Tape #600) | No Ag Transfer |
Abrasion Resistance, Pencil Hardness(H) | ≥2 |
Solderability | Not Recommended |
Operating Use Temperature (ºC) | <70 |
Shelf Life | Six Months from Date of Shipment |
Normally the typical steps for the electronic paste manufacturing is as below.
1) Raw materials inspection(mainly Ag and Al metal powder); 2) Materials adjust mixed and dispersion; 3) Rolled pulp; 4) Vacuumize; 5) Function Test(including Viscosity, fineness, conductivity, adhesion, solderability, etc.); 6) Package.