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8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module

China 8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module, Find details about China Telecom HDI PCB, Cell Phone Module from 8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module

Model NO.
GW-1920422115
Production Process
Blind&Buried Vias
Base Material
Copper
Insulation Materials
Epoxy Resin
Layer Count
8layer HDI PCB 2+N+2
HDI Structure
1+N+1 to Any Layer
Min. Trace/Space
2/2mil
Blind/Buried Vias
0.1mm Laser Drilling
Transport Package
Vacuum + Carton Packing
Origin
Made in China
HS Code
8534001000
Model NO.
GW-1920422115
Production Process
Blind&Buried Vias
Base Material
Copper
Insulation Materials
Epoxy Resin
Layer Count
8layer HDI PCB 2+N+2
HDI Structure
1+N+1 to Any Layer
Min. Trace/Space
2/2mil
Blind/Buried Vias
0.1mm Laser Drilling
Transport Package
Vacuum + Carton Packing
Origin
Made in China
HS Code
8534001000
HDI Layer Count 4L-32L mass production, 34L-64L quick-turn
MaterialHigh Tg material (Recommend Shengyi Material)
Finished Board Thickness0.8-4.8mm
Finished Copper ThicknessHoz-8oz
Max. Board Size600X800mm
Min. Drilling Size0.15mm, 0.1mm(laser drilling)
Blind/Buried vias depth ratio1:1
Min. Line Width/Spaceinner 2/2mil, outer 3/3mil
Surface FinishENIG, Immersiong Silver, Immersion Sn, Plated Gold, Plated Sn, OSP ect.
StandardIPC Class 2, IPC Class 3, Millitary
ApplicationIndustrial, Automotive, Consumer,Telecom, Medical, Military, Security ect.
Other3+N+3 to any layer

HDI circuit board advantages:
1. Reduce PCB cost: when the density of PCB increases more than eight layers, it will be manufactured with HDI, and the cost will be lower than that of the traditional pressing process;
2. Increase circuit density: interconnection between traditional circuit board and parts;
3. Conducive to the use of advanced construction technology;
4. Better electrical performance and signal correctness;
5. Better reliability;
6. Improve the thermal properties;
7. Improve RF interference, electromagnetic interference and electrostatic discharge (RFI/EMI/ESD);
8. Increase design efficiency.

Maybe we don't have the lowest price, but can guarantee you the best quality.
If you are interested, welcome to contact us. Here is the contact information as follows:
Shanghai Gawin Electronic Technology Co., Ltd.
Web: gawinpcba.en.made-in-china.com

Main Inspection Equipement
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module
8layer 0.8mm Em825 High Density Interconnect HDI PCB for Telecom Cell Phone Module



 

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