China LED Solder Reflow/Lead Free Reflow/Hot Air Reflow Oven/BGA Reflow, Find details about China LED Solder Reflow, Lead Free Reflow BGA from LED Solder Reflow/Lead Free Reflow/Hot Air Reflow Oven/BGA Reflow
Model | S10 |
GENERAL | |
Outside dimension | 5840 x 1360 x 1490mm |
Standard color | Computer grey |
Weight | 2400kg |
Number of heating zones | Up10/bottm10 |
Lengthof heating zones | 3480mm |
Number of cooling zones | 2(built-in) |
Exhaust volume | 10M3/min*2 exhausts |
Standard feature of control system | |
Electric supply required | 3phase, 380V 50/60Hz |
Electric power required | 67KW |
Power for warm up | 36KW |
Power consumption | 12KW |
Heating pattern | Up & Bottom Hot air |
Warming time | Approx. 30minute |
Temp. setting range | Room temp__300degree |
Control system | PLC+ Computer |
Temperature control method | PID close loop control +SSR driving |
Temperature control precision | ± 1.0degree |
Temperature deviation on PCB | ± 1.5degree |
Data storage | Process data and status storage (80GB) |
Abnormal alarm | Abnormal temperature(extra-high/extra-low temp) |
Board dropped alarm | Tower light: yellow warming: Green-normal: Red-abnormal |
Standard features of conveyor system | |
Max. width of PCB | Max: 500mm(Standard) |
Rail Number | 1 Lane Or 2 Lane (option) |
Components clearance | Top/bottom clearance of PCB is 25mm |
Conveyor height | Light → right(option: R→ L) |
PCB transmission agent | Air-reflow=chain +mesh (Standard) |
Conveyor height | 900± 20mm |
Conveyor speed range | 300~2000mm/min |