China Copper-ETP (C1100) Strip Used for PCB, Find details about China Copper Foil, Pure Copper Foil from Copper-ETP (C1100) Strip Used for PCB
Cu | Bi | Sb | As | Fe | Ni | Pb | S | Zn | ROHS Directive | |||
Cd | Pb | Hg | Cr | |||||||||
99.90 | 0.001 | 0.002 | 0.002 | 0.005 | - | 0.005 | 0.005 | - | ND | ND | ND | ND |
Melting Point - Liquidus | 1083ºC |
Melting Point - Solidus | 1065ºC |
Density | 8.91 gm/cm3@ 20 ºC |
Specific Gravity | 8.91 |
Electrical Resistivity | 1.71 microhm-cm @ 20 ºC |
Electrical Conductivity** | 0.591 MegaSiemens/cm @ 20 ºC |
Thermal Conductivity | 391.1 W/m ·oK at 20 C |
Coefficient of Thermal Expansion | 16.9 ·10-6perºC(20-100 ºC) |
Coefficient of Thermal Expansion | 17.3 ·10-6perºC(20-200 ºC) |
Coefficient of Thermal Expansion | 17.6·10-6perºC(20-300 ºC) |
Specific Heat Capacity | 393.5 J/kg ·oK at 293 K |
Modulus of Elasticity in Tension | 117000 Mpa |
Modulus of Rigidity | 44130 Mpa |
Quality ltems | General Technical Terms | ||||||
1/3 OZ/ft 2 (12μ m) | 1/2 OZ/ft 2 (18μ m) | 3/4OZ/ft 2 25μ m | 1 OZ/ft 2 35μ m | 7/5 OZ/ft 2 (1.4μ m) | 2 OZ/ft 2 (70μ m) | ||
Area Weight(g/) | 102-112 | 153 | 230 | 305 | 435 | 610 | |
Tensile Strenght(kg/mm 2) | STD-E | ≥ 205 | ≥ 205 | ≥ 235 | ≥ 275 | ≥ 275 | ≥ 275 |
HD-E | ≥ 17 | ≥ 103 | ≥ 156 | ≥ 205 | ≥ 205 | ≥ 205 | |
Elongation(%) | STD-E | ≥ 2 | ≥ 205 | ≥ 3 | ≥ 3 | ≥ 3 | ≥ 3 |
HD-E | ≥ 2 | ≥ 2.5 | ≥ 3 | ≥ 3 | ≥ 5 | ≥ 5 | |
Surface Roughness(μ m) | Shiny Surface Ra | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 | ≤ 0.43 |
Matte Surface Rz | 5 | 6 | 10 | 10 | 12 | 12 | |
Peel Strength(Kg/cm) | ≥ 1.1 | ≥ 1.2 | ≥ 1.8 | ≥ 1.8 | ≥ 2.1 | ≥ 2.1 | |
Leakage Poins(points/) | ≤ 5 | No | |||||
High Temperature Anti-Oxidization Performance | Treat in the 200 constant temperature for 60 minutes, there is no oxidation stain |