China JBT50/4D PUR Ellipse Glue Book Binding Machine, Find details about China glue binding machine, binding machine from JBT50/4D PUR Ellipse Glue Book Binding Machine
Introduction:
PUR hot melt glue binding mainframe pressure plate hot glue machine adopts Samsung 32-bit ARM7 series single chip microcomputer (CPU) for temperature and variable frequency motor program control, complete protection functions, precise and stable control, touch key input, 5.7-inch color LCD Chinese graphics Display, friendly operation interface.
Technical parameter:
Binding size | Max: 450*320mm Min: 140*65mm |
Binding thickness | 1.5-45mm |
Binding speed | 2000books/hour |
Power required | 12kw |
Weight | 2100kg |
Dimensions | 3100*1330*1450mm |