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12 Layer HDI PCB with Buried/Blind Via and Enig

China 12 Layer HDI PCB with Buried/Blind Via and Enig, Find details about China HDI PCB, Buried & Blind Board from 12 Layer HDI PCB with Buried/Blind Via and Enig

Model NO.
WBPN1035AO
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Application
Medical Instruments
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Fr4
Insulation Materials
Epoxy Resin
Brand
Xzg
Panel Size
198*195mm
Imersion Gold
2~3u"
Solder Mask
Green
Silkscreen
White
Trademark
XZG
Transport Package
Vacuum Packing
Specification
Rohs/UL
Origin
China
HS Code
8534001000

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