Super Precision Blade Dicing Saw for Wafer Cutting (DS623)

China Super Precision Blade Dicing Saw for Wafer Cutting (DS623), Find details about China Dicing Saw, Dicing Machine from Super Precision Blade Dicing Saw for Wafer Cutting (DS623)

Basic Info.

Model NO.

DS623

Alignment System

70X Straight Light + Ring Light(240X Optional)

Spindle: Revolution Speed Range

10000~50000 Rpm

Spindle: Output Power

1.5kw (2.4kw Optional)

X Axis: Feed Speed Range

0.1~500mm/S

Y Axis: Single-Step Accuracy

≤0.002mm/5mm

Z Axis: Repeatability Accuracy

0.002mm

Power Supply

Single Phase, AC220V±10%

Power Consumption

0.8kw (Processing); 0.7kw (Warming up)

Transport Package

Standard Export Packing

Specification

580mm× 850mm× 1680mm; 500kg

Origin

China

HS Code

84862090

Model NO.

DS623

Alignment System

70X Straight Light + Ring Light(240X Optional)

Spindle: Revolution Speed Range

10000~50000 Rpm

Spindle: Output Power

1.5kw (2.4kw Optional)

X Axis: Feed Speed Range

0.1~500mm/S

Y Axis: Single-Step Accuracy

≤0.002mm/5mm

Z Axis: Repeatability Accuracy

0.002mm

Power Supply

Single Phase, AC220V±10%

Power Consumption

0.8kw (Processing); 0.7kw (Warming up)

Transport Package

Standard Export Packing

Specification

580mm× 850mm× 1680mm; 500kg

Origin

China

HS Code

84862090

Product Desciption

DS623 super precision dicing machine uses the imported high-power DC spindle and performance is more excellent. The spindle has self-locking function and makes it much easier to replace the blade. DS623 is applicable to the cutting process of silicon, PCB, ceramic, glass, lithium niobate, alumina, quartz and sapphire.

Features

With dual lens and higher alignment accuracy
Broken Blade Detector (BBD)
Grinding machine function
Automatic edge-searching function
Data scanning function

Specifications
Configuration and performance	Workpiece size	Φ160mm \| ≤150mm x 150mm
	Groove depth	≤4mm or customize
	Table flatness	±0.005mm/150mm
	Alignment system	70x straight light + ring light (240x optional)
Spindle	Revolution speed range	10000~50000 rpm
Spindle	Output power	1.5kW (2.4kW optional)
X axis	Drive mode	Servo motor
	Max. stroke	240mm
	Stroke resolution	0.001mm
	Feed speed range	0.1~500mm/s
Y axis	Drive mode	Step motor + grating closed-loop control system
	Max. stroke	170mm
	Stroke resolution	0.0001mm
	Single-step positioning accuracy	≤0.002mm/5mm
	Index positioning accuracy	≤0.004mm/170mm
Z axis	Drive mode	Step motor
	Max. stroke	30mm
	Stroke resolution	0.001mm
	Repeatability accuracy	0.002mm
Θ axis	Drive mode	Imported DD motor
	Max. rotating angle	380°
	Angle resolution	0.0002°
Basic specification	Power supply	Single phase, AC220V±10%
	Power consumption	0.8kW (processing)
	Power consumption	0.7kW (warming up)
	Compressed air	Pressure: 0.55~0.8Mpa; average flow rate: 450L/min
	Cleaning water	Pressure: 0.2~0.4Mpa; flow rate: 3.5L/min
	Cooling water	Pressure: 0.2~0.4Mpa; flow rate: 1.5L/min
	Exhaust air rate	1.5m³/min (ANR)
	Overall dimensions W×D×H	580mm×850mm×1680mm
	Weight	500kg

Environmental Conditions

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
• Please follow the product manual of our company.

Super Precision Blade Dicing Saw for Wafer Cutting (DS623)