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High Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 CE

China High Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 CE, Find details about China Dicing Saw, Dicing Machine from High Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 CE

Model NO.
DS830
Groove Depth
≤4mm or Customize
Alignment System
80X Straight Light + Ring Light (40X 210X Optional
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw (2.2kw Optional)
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.9kw (Processing); 0.8kw (Warming up)
Transport Package
Standard Export Packing
Specification
775mm× 960mm× 1650mm; 600kg
Origin
China
HS Code
84862090
Model NO.
DS830
Groove Depth
≤4mm or Customize
Alignment System
80X Straight Light + Ring Light (40X 210X Optional
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw (2.2kw Optional)
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.9kw (Processing); 0.8kw (Warming up)
Transport Package
Standard Export Packing
Specification
775mm× 960mm× 1650mm; 600kg
Origin
China
HS Code
84862090
DS830 precision dicing machine uses the DS-300 software control system, imported high-resolution lens and camera to enhance graphics alignment accuracy and efficiency. DS830 is applicable to the cutting process of silicon, PCB, ceramic, glass, lithium niobate, alumina and quartz.

Features
  1. Graphical and simulative display of cutting process
  2. Water and gas curtain employed to reduce cutting powder residue
  3. Multi-angle water spray
  4. Broken Blade Detector (BBD) option
Specifications
 
Configuration and performance      Workpiece sizeΦ200mm | 180mm (for square)
Groove depth≤4mm or customize
Table flatness±0.005mm/150mm
Alignment system80x straight light + ring light (40x 210x optional) 
SpindleRevolution speed range10000~50000 rpm  
Output power1.5kW(2.2kW optional)
X axisDrive modeServo motor
Max. stroke380mm
Stroke resolution0.001mm
Feed speed range0.1~400mm/s
Y axis Drive modeStep motor + grating closed-loop control system
Max. stroke210mm
Stroke resolution0.0005mm
Single-step positioning accuracy≤0.003mm/5mm
Index positioning accuracy ≤0.005mm/210mm
Z axisDrive modeStep motor
Max. stroke30mm
Stroke resolution0.001mm 
Repeatability accuracy0.002mm
Θ axis Drive modeDD motor
Max. rotating angle380°
Angle resolution0.0002° 
Basic specificationPower supplySingle phase, AC220V±10%
Power consumption0.9kW (processing)
0.8kW (warming up)
Compressed airPressure: 0.55~0.8Mpa; average flow rate: 350L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate 3.0L/min
Cooling waterPressure: 0.2~0.4Mpa; flow rate 1.5L/min
Exhaust air rate1.8m3/min (ANR)
Overall dimensions W×D×H775mm×960mm×1650 mm
Weight 600kg
 
Environmental Conditions
 

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
• Please follow the product manual of our company.

High Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 CEHigh Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 CE
High Precision Blade Dicing Saw for 8" Wafer Cutting Ds830 CE

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