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Diamond Cutting Blade for Wafering and Dicing

China Diamond Cutting Blade for Wafering and Dicing, Find details about China Resin Bond Diamond Cutting Blade, Resin Bond Diamond Dicing Blade from Diamond Cutting Blade for Wafering and Dicing

Model NO.
1A1, 1A8, 1A1W, 1A1R
Kind
Diamond Wheel
Manufacturing Arts
Sinter
Usage
Stone Cutting, Plastics, Laminate Plate, Semiconductor Cutting, Lab Use Super-thin Saw Blade, Optical Glass Cutting, Fire-Retardant, Porcelain, Drilling, Arts Cutting, Engineering Material
Saw Blade External Diameter
150mm

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