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China Factory Precision Dicing Saw for 6
China Factory Precision Dicing Saw for 6

China Factory Precision Dicing Saw for 6" 8" 10" 12" for PCB, Silicon, Wafer

China Factory Precision Dicing Saw for 6" 8" 10" 12" for PCB, Silicon, Wafer, Find details about China Dicing Saw, Dicing Machine from China Factory Precision Dicing Saw for 6" 8" 10" 12" for PCB, Silicon, Wafer

Model NO.
Dicing Saw DS830
Groove Depth
≤4mm or Customize
Alignment System
70X Straight Light + Ring Light(210X Optional)
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.9kw (Processing); 0.8kw (Warming up)
Transport Package
Standard Export Packing
Specification
775mm× 960mm× 1650 mm; 600kg
Origin
China
HS Code
84862090
Model NO.
Dicing Saw DS830
Groove Depth
≤4mm or Customize
Alignment System
70X Straight Light + Ring Light(210X Optional)
Spindle: Revolution Speed Range
10000~50000 Rpm
Spindle: Output Power
1.5kw
X Axis: Feed Speed Range
0.1~400mm/S
Y Axis: Single-Step Accuracy
≤0.003mm/5mm
Z Axis: Repeatability Accuracy
0.002mm
Power Supply
Single Phase, AC220V±10%
Power Consumption
0.9kw (Processing); 0.8kw (Warming up)
Transport Package
Standard Export Packing
Specification
775mm× 960mm× 1650 mm; 600kg
Origin
China
HS Code
84862090
DS820 precision dicing saw can be widely used for a variety of processing requirements. DS820 uses DS-200 software control system, touch screen control and GUI interface so that the image alignment of workpiece is simple and convenient. DS820 has stable performance and low failure rate. DS820 is applicable to the cutting process of blue glass, silicon, GaAs, PCB, ceramic, sapphire, crystal, lithium niobate, alumina and quartz.

Features
  1. Available for workpiece with the dimension of 210 x 210mm
  2. Available for cutting large-size square-chip and small size multi-chip materials
  3. Cutting range can be adjusted based on needs to improve production efficiency
  4. Reasonable structure
  5. Low failure rate
  6. Convenience for maintenance
Specifications
 
Configuration and performance      Workpiece sizeΦ200mm | 180mm (for square)
Groove depth≤4mm or customize
Table flatness±0.005mm/100mm
Alignment system70x straight light + ring light (210x optional) 
SpindleRevolution speed range10000~50000 rpm  
Output power1.5kW
X axisDrive modeServo motor
Max. stroke380mm
Stroke resolution0.001mm
Feed speed range0.1~400mm/s
Y axis Drive modeStep motor + grating closed-loop control system
Max. stroke210mm
Stroke resolution0.0005mm
Single-step positioning accuracy≤0.003mm/5mm
Index positioning accuracy ≤0.005mm/210mm
Z axisDrive modeStep motor
Max. stroke30mm
Stroke resolution0.001mm 
Repeatability accuracy0.002mm
Θ axis Drive modeDD motor
Max. rotating angle360°
Angle resolution0.0005° 
Basic specificationPower supplySingle phase, AC220V±10%
Power consumption0.9kW (processing)
0.8kW (warming up)
Compressed airPressure: 0.55~0.8Mpa; average flow rate: 350L/min
Cleaning water Pressure: 0.2~0.4Mpa; flow rate: 3.0L/min
Cooling waterPressure: 0.2~0.4Mpa; flow rate: 1.5L/min
Exhaust air rate1.8m3/min (ANR)
Overall dimensions W×D×H775mm×960mm×1650 mm
Weight 600kg
 
Environmental Conditions
 

• Use clean, oil-free air (dew point below -15, residual oil: 0.1 ppm, and filtration rating: 0.01μm/99.5 % or more).
• Keep room temperature fluctuations within ±1ºC of the set value (Set value should be between 20ºC - 25ºC), indoor humidity no more than 80% and no condensation.
• Keep cutting water and cleaning water 2ºC above room temperature (fluctuations within ±1ºC). Keep temperature of cooling water the same as room temperature.
• The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.
• This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.
• Please follow the product manual of our company.

China Factory Precision Dicing Saw for 6" 8" 10" 12" for PCB, Silicon, Wafer
China Factory Precision Dicing Saw for 6" 8" 10" 12" for PCB, Silicon, Wafer

China Factory Precision Dicing Saw for 6" 8" 10" 12" for PCB, Silicon, Wafer

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