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Silicon Wafer Thickness 0.13mm Disco Dicing Saw Dicing Blades

China Silicon Wafer Thickness 0.13mm Disco Dicing Saw Dicing Blades, Find details about China Diamond Dicing Blades, Diamond Dicing Blade from Silicon Wafer Thickness 0.13mm Disco Dicing Saw Dicing Blades

Model NO.
customered
Blade Type
Turbine
Manufacturing Process
Sintered
Application
Ceramic
Trademark
More super hard
Transport Package
Carton
Specification
150*31.75*1.0
Origin
China
HS Code
8207901000

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