Multi-Layers PCB Assembly, Full Turnkey Contract Manufactuering for PCBA
China Multi-Layers PCB Assembly, Full Turnkey Contract Manufactuering for PCBA, Find details about China PCB Assembly, Turnkey PCBA from Multi-Layers PCB Assembly, Full Turnkey Contract Manufactuering for PCBA
Basic Info.
Model NO.
pcba-11
Condition
New
Quality Standard
Ipc 610 Class II
Trademark
GMT
Transport Package
ESD Bag + Bubble Bag + Carton Box
Specification
HDI PCB with BGA
Origin
China
Model NO.
pcba-11
Condition
New
Quality Standard
Ipc 610 Class II
Trademark
GMT
Transport Package
ESD Bag + Bubble Bag + Carton Box
Specification
HDI PCB with BGA
Origin
China
Product Desciption
Shenzhen GMT Electronic Co.,Ltd provides Full turn-key electronic OEM contract manufacturing services, from components procurement, SMT assembly, DIP assembly, hand soldering, cable assembly to housing Assembly(box build).
We also can provide electronic ODM technique support service, like schematic design, PCB layout service, PCB layout improvement service, equivelent substitute recommendation for cost down, mechanical design service and software design service, etc.
Our production lines are equipped with automatic machines totally high speed and high accuracy. Our minimum SMD component precision can meet 0201, and THT precision down to 0.6mm, skilled in ball grid array (BGA) assembly. All products fully conducted test, AOI test, functional text, burn-in test to secure product quality. We fully follow IPC-A-610E class II and class III standard.
High quality and on-time delivery is always our promise.
1. PCBA, PCB assembly: SMT & PTH & BGA
2. PCBA and enclosure design
3. Components sourcing and purchasing
4. Quick prototyping
5. Plastic injection molding
6. Metal sheet stamping
7. Final assembly
8. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
9. Custom clearance for material importing and product exporting
We also can provide electronic ODM technique support service, like schematic design, PCB layout service, PCB layout improvement service, equivelent substitute recommendation for cost down, mechanical design service and software design service, etc.
Our production lines are equipped with automatic machines totally high speed and high accuracy. Our minimum SMD component precision can meet 0201, and THT precision down to 0.6mm, skilled in ball grid array (BGA) assembly. All products fully conducted test, AOI test, functional text, burn-in test to secure product quality. We fully follow IPC-A-610E class II and class III standard.
High quality and on-time delivery is always our promise.
1. PCBA, PCB assembly: SMT & PTH & BGA
2. PCBA and enclosure design
3. Components sourcing and purchasing
4. Quick prototyping
5. Plastic injection molding
6. Metal sheet stamping
7. Final assembly
8. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
9. Custom clearance for material importing and product exporting
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