China Power Bank PCB Circuit Board Assembly /PCBA Manufacture Factory, Find details about China PCBA, PCB SMT from Power Bank PCB Circuit Board Assembly /PCBA Manufacture Factory
PCB Manufacture Capability | |
Item | Manufacture Capability |
Layers | 1-26 Layers |
HDI | 2+N+2 |
Material Types | Fr-4, Fr-5, High-Tg, Aluminum Based , Halogen Free, |
Isola, Taconic, Arlon, Teflon, Rogers, | |
Max. Panel Dimension | 39000mil * 47000mil (1000mm * 1200mm) |
Outline Tolerance | ± 4mil (± 0.10mm) |
Board Thickness | 8mil-236mil (0.2 - 6.0mm) |
Board Thickness Tolerance | ± 10% |
Dielectric Thickness | 3mil-8mil ( 0.075mm-0.20mm) |
Min. Track Width | 3mil ( 0.075mm ) |
Min. Track Space | 3mil ( 0.075mm ) |
External Cu Thickness | 0.5 OZ - 10 OZ ( 17um - 350um) |
Internal Cu Thickness | 0.5OZ - 6OZ ( 17um - 210um) |
Drilling Bit Size ( CNC ) | 6mil-256mil ( 0.15mm - 6.50mm) |
Finished Hole Dimension | 4mil-236mil(0.1mm - 6.0mm) |
Hole Tolerance | ± 2mil (± 0.05mm) |
Laser Drilling Hole Size | 4mil(0.1mm) |
Aspect Ration | 16: 1 |
Solder Mask | Green, Blue, White, Black, Red, Yellow, Purple, etc. |
Min Solder mask Bridge | 2mil(0.050mm) |
Plugged Hole Diameter | 8mil-20mil ( 0.20mm-0.50mm) |
Beveling | 30o - 45o |
V-scoring | +/-0.1mm, 15o 30o 45o 60o |
Impedance Control | Min. 5% General ± 10% |
Surface Finishing | HASL, HASL(lead Free), Immersion Gold |
Immersion Silver, OSP, Hard Gold ( up to 100u" ) | |
Certification | UL RoHS ISO9001: 2000 ISO14000: 2004 SGS |
Testing | Flying probe, E-TEST, X-RAY Inspection , AOI |
Files | Gerber Protel DXP Auto CAD PADS OrCAD Express PCB etc |
PCB Prototype Lead Time: | ||
item | General time | Quick Turn |
1-2 | 4 days | 1 days |
4-6 Layers | 6 days | 2 days |
8-10 Layers | 8 days | 3 days |
12-16 Layers | 12 days | 4days |
18-20 Layers | 14 days | 5 days |
22-26 Layers | 16 days | 6 days |
Note: Base on all data received by us and must be complete and problem free, Lead time is ready to ship time. |