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Multilayer Printed Circuit Board with High Tg HDI PCB

China Multilayer Printed Circuit Board with High Tg HDI PCB, Find details about China FPC, Rigid PCB from Multilayer Printed Circuit Board with High Tg HDI PCB

Model NO.
SM-02
Type
Combining Rigid Circuit Board
Dielectric
Fr4 Tg180
Material
Fiberglass Epoxy
Application
Communication
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Epoxy Resin
Brand
Kb
Board Thickness
0.2mm to 6.0mm (0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0..)
Surface Finish
HASL Lead Free, Enig, OSP, Flash Gold, Immersion T
Solder Mask and Silk Screen Colour
Green, White, Yellow, Black, Blue, Red...
Base Materials
Fr4, High Tg, Cem3, Rogers, Halogen Free, Aluminum
Copper Thickness
1oz to 5oz
Min Hole Size
0.1mm
Hole Copper Thickness
25um
Max Board Size
500 X 1200mm
Carbon Ink, Peelable Mask, Blind, Burry
Yes
Key Words
Double Sided, Fast PCB, FPC, Quick Turn PCB, Rigid
Trademark
Shared
Transport Package
Vacuum Packing
Specification
1-24 layers
Origin
China
HS Code
8534001000

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