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HDI Tg180 PCB Fabrication and PCB Diagram

China HDI Tg180 PCB Fabrication and PCB Diagram, Find details about China PCB Assembly, Fr4 SMT &DIP Board from HDI Tg180 PCB Fabrication and PCB Diagram

Model NO.
pcb
Type
Rigid Circuit Board
Dielectric
FR-4
Material
Fiberglass Epoxy
Flame Retardant Properties
V0
Mechanical Rigid
Rigid
Processing Technology
Electrolytic Foil
Base Material
Copper
Insulation Materials
Organic Resin
Model
FR-4
Brand
Rigao
Layer
1-22 L
Type of Assembly
SMT and Thru-Hole
Type of Service
Urn-Key, Partial Turn-Key or Consignment
File Formats
Bom, Gerber, Pick-N-Place File (Xyrs)
Components
Leadlesschip Carriers/Csp;BGA Repair...
Component Packaging
Cut Tape, Tube, Reels, Loose Parts
Quantity
No MOQ
Testing
X-ray Inspection & Aoi Test
Copper Thickness
Outer Layer:1oz~6oz Inner Layer:Hoz~5oz
Min. Line Width/Space
4/4mil(0.1/0.1mm)
Trademark
Rigao Electronics PCBA
Transport Package
Carton/ Vacuum/ Bubble Bags, According to Custome
Specification
CE, ISO, UL
Origin
China(Mainland)
HS Code
853400900

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