China 1, . 5mm 35/00um Copper Clad Laminate Ccl Offcuts Fr1, Cem1, Fr4, Find details about China Laminated Copper Sheet Fr4, Fr4 Offcut from 1, . 5mm 35/00um Copper Clad Laminate Ccl Offcuts Fr1, Cem1, Fr4
Item Name | FR-4 Copper clad laminate | Copper Thickness | 18um,25um,35um,70um |
Size | 40*48inch,41*49inch,43*49inch | Color | yellow |
Thickness | 0.4mm,0.8mm,1mm,1.2mm, 1.6mm,2.4mm | Glass Transition Temperature | 135-155 °C |
Test Item | Test Condition | Unit | SPEC | Typical Value |
Tg | DSC | °C | ≥125 | 135 |
Peel strength(1OZ) | 288°C,10S | N/mm | ≥1.05 | 1.41 |
Thermal Stress | 288°C,10S/solder dip | ____ | >10 | 60S/ No delamination No Delamination |
Flexural Strength | N/mm2 | LW | ≥415 | 500 |
Flammability | E24/125 | ____ | UL94 V-0 | V-0 |
Surface Resistivity | After moisture | MΩ | ≥1. 0×104 | 2.0×106 |
Volume Resistivity | After moisture | MΩ.cm | ≥1.0×106 | 2.0×108 |
Dielectric Constant(1MHZ) | 1MHz C-24/23/50 | ____ | ≤5.4 | 4.7 |
Dissipation Factor(1MHZ) | 1MHz C-24/23/50 | ____ | ≤0.035 | 0.017 |
Loss Tangent | 1MHz C-24/23/50 | ____ | ≤0.035 | 0.016 |
Arc Resistivity | D-48/50+D-0.5/23 | S | ≥60 | 135 |
Dielectric Breakdown | D-48/50+D-0.5/23 | KV | ≥40 | 60 |
Moisture Absorption | D-24/23 | % | ≤0.8 | 0.15 |
CTI | IEC60112 Method | V | 175~250 | 210 |
Cooper clad laminate | |||||
AL CCL | FR-4 | FR-1 | CEM-1 | XPC | |
Base material | aluminum | fiberglass | fiberglass | paper+fiber glass | paper |
Color | blue film green film | light green,yellow | brown | yellow+white | brown |
Copper foil | single or double side:18,25,35,70 micron | single side:18,25,35,70 micron | |||
Sheet thickness | 0.4-2mm | ||||
Size | 1000*1200mm 500*600mm 1000*600mm 500*1200mm | 40''*48'' , 41''*49'' , 43''*49'' | 41''*49'' |