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Metal Core Copper Clad Laminate Alccl MCPCB Raw Material

China Metal Core Copper Clad Laminate Alccl MCPCB Raw Material, Find details about China Mcpcb Raw Material, Alccl from Metal Core Copper Clad Laminate Alccl MCPCB Raw Material

Model NO.
ALCCL
Type
Rigid Circuit Board
Dielectric
Aluminum Based Copper Clad Laminate
Material
Fiberglass Epoxy Resin + Polyimide Resin
Flame Retardant Properties
V0
Structure
Sandwich Structure, Which Includes Layers of Condu
Standard Size (Mm)
1100X1200mm,1000X1200mm
Circuit Layer(Copper Foil )
18um,35um,70um,105um(Hoz,1oz,2oz, 3oz)
Thermal Dielectric Layer Thickness
75um,100um,125um,150um,(3mil,4mil,5mil,6mil)
Thickness
0.8mm,1.0mm,1.2mm,1.5mm,1.5mm,2.0mm
Aluminum Substrate Type
1100,1060,3003,5052,6061 Anodization
Masking Film
PE,Pet,Pi
Using Scope
LED Lighting, Public Lighting, Backlight Module, O
Payment
L/C,T/T,D/a,D/P
Delivery
10-18 Days From Receipt of Advanced 30% Deposit
Trademark
LESON
Specification
ISO, UL, RoHS,
Origin
Cn
HS Code
74102110

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