Green Motherboard for Hot Electronics

China Green Motherboard for Hot Electronics, Find details about China PCB, Motherboard from Green Motherboard for Hot Electronics

Model NO.
pcba
Condition
Used
Material
Shengyi Fr4
Mini Hole
0.25mm
Mini Width/Space
5/5mil
Solder Mask
Green
Silkscreen
White
Copper
1/0.5oz
Finish
HASL Lead Free
Trademark
NO
Transport Package
Anti-Electrostatic Packaging
Specification
182 x 88mm
Origin
Made in China
HS Code
8534001000
Model NO.
pcba
Condition
Used
Material
Shengyi Fr4
Mini Hole
0.25mm
Mini Width/Space
5/5mil
Solder Mask
Green
Silkscreen
White
Copper
1/0.5oz
Finish
HASL Lead Free
Trademark
NO
Transport Package
Anti-Electrostatic Packaging
Specification
182 x 88mm
Origin
Made in China
HS Code
8534001000

Quality Policy
transcendent quality,perfect embodiment,Prevent pollution,Energy efficiency,Green production,Continual improvement,customers' satisfaction.



Quality Target:
Non Automobile products:
Rate of the first passed products:>95%
Rate of delivery on time:>98%
Rate of customer's complaint:<1%


Automobile products:
Rate of the first passed products :100%
Rate of customer's complaint::<0.5%

 
 
Detailed Photos

 

Green Motherboard for Hot Electronics

 

 

Product Parameters
Rigid PCB Production Capacity
SERIALITEMTECHNICAL DATA
1Types of ProductsHDL Multilayer PCB, Buried/Blind Via Board, High Frequency Board, Aluminum Base Board Flex-Rigid PCB,Teflon Board, and HDI
2Layers2-32(layers)
3Max Board Size450x660mm 18" x 26"
4Min Board Thickness4(layers)0.40mm 16mil
6(layers)0.80mm 32mil
8(layers)1.00mm 40mil
10(layers)1.20mm 48mil
5Copper Clad(Max.)20 oz(outer)/4 oz(inner)
6Min line Width/space0.075mm    3mil
7Drill Size Mechanical (min)0.20mm 8mil
8Drill Size Laser(min)0.10mm 4mil
9PTH Wall Thickness0.020mm 0.8mil
10PTH dia tolerance±0.075mm ±3mil
11NPTH hole dia tolerance±0.05mm ±2mil
12Hole Position Deviation±0.05mm ±2mil
13Outline Tolerance±0.10mm ±4mil
14S/M Pitch0.08mm 3mil
15Insulation Resistance1E+12Ω(Normal)
16Test Voltage50~300V
17Aspect ratio8:01
18Thermal Shock3x10Sec@288 ºC
19Warp and Twist≤0.7%
20Current breakdown10A
21Electric Strength>1.3KV/mm
22Peel Strength1.4N/mm
23Solder Mask Abrasion≥6H
24Flammability94V-0
25Impedance Control+/-10%(Differential)
26Buried ViaYes
27Blind ViaYes
28HDI2+N+2 4mil Via hole
29Surface FinishedENIG, ImAg, ImSn, OSP, HASL free
30MaterialsFR-4 , Copper core,  Getek , Rogers, Aluminum core,  High TG, Teflon,     black Fr4 

 

 

Packaging & Shipping

 

Green Motherboard for Hot Electronics
FAQ

 

Green Motherboard for Hot Electronics